Title:
CLEANING SOLUTION FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/205797
Kind Code:
A1
Abstract:
The present invention provides a cleaning solution for a semiconductor substrate, the cleaning solution demonstrating excellent anticorrosion performance when employed as a cleaning solution for a post-CMP semiconductor substrate that includes a tungsten-containing substance. This semiconductor substrate cleaning solution is used to clean a semiconductor substrate, and includes: a compound having one or more groups selected from the group consisting of a group represented by general formula (I) and a group represented by general formula (II); an organic acid; and an amino alcohol.
Inventors:
KAMIMURA TETSUYA (JP)
OUCHI NAOKO (JP)
YAMADA SHIMPEI (JP)
OUCHI NAOKO (JP)
YAMADA SHIMPEI (JP)
Application Number:
PCT/JP2021/008750
Publication Date:
October 14, 2021
Filing Date:
March 05, 2021
Export Citation:
Assignee:
FUJIFILM ELECTRONIC MAT CO LTD (JP)
International Classes:
C11D17/08; C11D1/34; C11D3/20; C11D3/26; C11D3/30; C11D3/36; C11D3/37; C11D7/22; C11D7/26; C11D7/32; H01L21/304
Domestic Patent References:
| WO2019187868A1 | 2019-10-03 |
Foreign References:
| JP2019156990A | 2019-09-19 | |||
| JP2007335856A | 2007-12-27 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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