CLEAVING DEVICE AND CLEAVING METHOD

WIPO Patent Application WO/2020/261854

A1

Provided is a cleaving device which is for cleaving a synthetic product synthesized by means of a solid-phase method from a solid-phase carrier, and which ensures safe operation and high yield efficiency. More specifically, the cleaving device according to the present invention for cleaving a synthetic product synthesized on a solid-phase carrier from said solid-phase carrier within a reactor in which the solid-phase carrier is encapsulated, the cleaving device being configured to be provided with: a retention part which retains the reactor, having the synthetic product synthesized therein, while maintaining the solid-phase carrier encapsulated therein; a reagent supply part which is disposed so as to be connectable, via a supply channel, to the reactor being retained by the retention part and which is for supplying a reagent for cleaving the synthetic product from the solid-phase carrier; and a recovery part which is disposed so as to be connectable, via a connection channel, to the reactor and which is for recovering, from the reactor, the synthetic product cleaved from the solid-phase carrier.

JPS59172499	MAGNETIC PARTICLE AS SUPPORTER FOR ORGANIC SYNTHESIS
JP4898119	A detectable nucleoside analog by which the label was carried out, and directions for use for the same
WO/2007/076129	NANOREPORTERS AND METHODS OF MANUFACTURING AND USE THEREOF

INAKA CHISA (JP)
TSUDA YUICHIRO (JP)
NIWA TSUKASA (JP)

JP2020/020935

December 30, 2020

May 27, 2020

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TORAY ENG CO LTD (JP)

C07H21/00; C12M1/00

JP2019058859A	2019-04-18
JP2014047169A	2014-03-17
JP2017008038A	2017-01-12
JPH08500095A	1996-01-09

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