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Patent Searching and Data


Title:
CLEAVING DEVICE AND CLEAVING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/261854
Kind Code:
A1
Abstract:
Provided is a cleaving device which is for cleaving a synthetic product synthesized by means of a solid-phase method from a solid-phase carrier, and which ensures safe operation and high yield efficiency. More specifically, the cleaving device according to the present invention for cleaving a synthetic product synthesized on a solid-phase carrier from said solid-phase carrier within a reactor in which the solid-phase carrier is encapsulated, the cleaving device being configured to be provided with: a retention part which retains the reactor, having the synthetic product synthesized therein, while maintaining the solid-phase carrier encapsulated therein; a reagent supply part which is disposed so as to be connectable, via a supply channel, to the reactor being retained by the retention part and which is for supplying a reagent for cleaving the synthetic product from the solid-phase carrier; and a recovery part which is disposed so as to be connectable, via a connection channel, to the reactor and which is for recovering, from the reactor, the synthetic product cleaved from the solid-phase carrier.

Inventors:
INAKA CHISA (JP)
TSUDA YUICHIRO (JP)
NIWA TSUKASA (JP)
Application Number:
JP2020/020935
Publication Date:
December 30, 2020
Filing Date:
May 27, 2020
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
International Classes:
C07H21/00; C12M1/00
Foreign References:
JP2019058859A2019-04-18
JP2014047169A2014-03-17
JP2017008038A2017-01-12
JPH08500095A1996-01-09
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