CLIP

WIPO Patent Application WO/2011/065121

A1

Disclosed is a resin-material clip (200) provided with a locking portion (6) which is inserted into and engages with a clip insertion hole (7) of a protrusion (1a) of a panel (1), and also provided with a manipulated portion (9) for manipulation by an operator. In a state in which the protrusion (1a) of the panel (1) is fitted into the protrusion insertion hole (5a) of a panel mounting section (5) of a speaker bracket (3), the locking portion (6) of the clip (200) is inserted into the exposed clip insertion hole (7). The top portion (12b) of the engaging main portion (12) of the clip (200) presses on the inner surface of the clip insertion hole (7), bending the protrusion (1a). Further, a rear sloping portion (19b) of a claw portion (13) of the clip (200) presses on the front horizontal edge (21b) of the ceiling of the clip insertion hole (7), and two joints (14) of the clip (200) press on the vertical edge (22) of the inner wall of the clip insertion hole (7). By this means, a clip is provided which can easily and reliably fix materials which generate vibration.

KABEYA SATOSHI (JP)
KATO MAKOTO (JP)
KAWAGUCHI HIDEYUKI (JP)
KAJI ATSUTOSHI (JP)

PCT/JP2010/066780

June 03, 2011

September 28, 2010

Click for automatic bibliography generation  

TOYOTA AUTO BODY CO LTD (JP)
DAIWA KASEI INDUSTRY CO LTD (JP)
KABEYA SATOSHI (JP)
KATO MAKOTO (JP)
KAWAGUCHI HIDEYUKI (JP)
KAJI ATSUTOSHI (JP)

F16B19/00; F16B5/06; F16B5/07

JP2002031110A	2002-01-31
JPH074127U	1995-01-20
JPS57155308U	1982-09-29
JPS6246736A	1987-02-28
JP2002372011A	2002-12-26

SUGAWARA, Masatsune (JP)
Masamichi Sugawara (JP)

View/Download PDF      PDF Help

Previous Patent: IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, IMAGE PROCESSING PROGRAM, AND COMPUTER-READABLE RE...

Next Patent: METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE