Title:
CMOS IMAGE SENSOR ENCAPSULATION MODULE AND METHOD FOR FORMING SAME, AND CAMERA APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/173058
Kind Code:
A1
Abstract:
Provided are a CMOS image sensor encapsulation module and a method for forming same, and a camera apparatus comprising the CMOS image sensor encapsulation module. According to the CMOS image sensor encapsulation module, a signal processing chip (200) and a DRAM chip (600) are bonded to a pixel circuit substrate (100); the signal processing chip (200) is electrically connected to the DRAM chip (600) through a first interconnection structure (210); and a readout circuit in the pixel circuit substrate (100), the signal processing chip (200) and the DRAM chip (600) are all electrically connected to a second interconnection structure (220), and a wiring layer (500) is electrically connected to the second interconnection structure (220). The structure of the encapsulation module is optimized, thereby facilitating first caching a digital image signal output by the readout circuit in the DRAM chip (600) before the digital image signal is transmitted to the signal processing chip (200) by the DRAM chip (600) for processing. When the CMOS image sensor encapsulation module is used for image photographing, same is advantageous for improving the speed of processing transmitted data and digital image signal, thereby improving the image quality.
Inventors:
XIANG YANGHUI (CN)
Application Number:
PCT/CN2019/102254
Publication Date:
September 03, 2020
Filing Date:
August 23, 2019
Export Citation:
Assignee:
NINGBO SEMICONDUCTOR INT CORP (CN)
International Classes:
H01L27/148
Foreign References:
| CN108735770A | 2018-11-02 | |||
| CN106104770A | 2016-11-09 | |||
| CN107068629A | 2017-08-18 | |||
| CN108091661A | 2018-05-29 | |||
| CN105070667A | 2015-11-18 | |||
| CN107507821A | 2017-12-22 | |||
| US20180151621A1 | 2018-05-31 |
Attorney, Agent or Firm:
SHANGHAI SAVVY IP AGENCY CO., LTD. (CN)
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