CMP CONDITIONER, METHOD FOR ARRANGING RIGID GRAINS USED FOR CMP CONDITIONER, AND METHOD FOR MANUFACTURING CMP CONDITIONER

Title:

CMP CONDITIONER, METHOD FOR ARRANGING RIGID GRAINS USED FOR CMP CONDITIONER, AND METHOD FOR MANUFACTURING CMP CONDITIONER

Document Type and Number:

WIPO Patent Application WO/2002/049807

Kind Code:

A1

Abstract:

A CMP conditioner for suppressing microscratches on the surface of a semiconductor substrate and for obtaining stable CMP conditioner characteristics. The CMP conditioner by a first mode comprises a support member and rigid grains provided on the face of the support member, wherein the rigid grains are regularly arranged on a face of the support member. The CMP conditioner by a second mode comprises a support member and rigid grains provided on a face of the support member, wherein the rigid grains are arranged regularly on a face of the support member so that the density may decrease outward from inside the support member.

Inventors:

KINOSHITA TOSHIYA (JP)
HASHINO EIJI (JP)
SATO SETSUO (JP)
ARAKI RYUICHI (JP)

Application Number:

PCT/JP2001/011209

Publication Date:

June 27, 2002

Filing Date:

December 20, 2001

Export Citation:

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Assignee:

NIPPON STEEL CORP (JP)
KINOSHITA TOSHIYA (JP)
HASHINO EIJI (JP)
SATO SETSUO (JP)
ARAKI RYUICHI (JP)

International Classes:

B24B53/017; B24B53/12; B24D3/06; B24D3/14; B24D7/14; B24D18/00; (IPC1-7): B24B53/12; B24D3/00

Foreign References:

JPS6076965A	1985-05-01
JPH04250978A	1992-09-07
JP2000052254A	2000-02-22

Other References: