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Patent Searching and Data


Title:
CMP CONDITIONER AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/038583
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a CMP conditioner having excellent corrosion resistance around abrasive grains. [MEANS FOR SOLVING PROBLEMS] A grindstone base having, formed on one side, an abrasive grain layer comprising a metallic bonding phase and abrasive grains fixed thereto is treated to form a first protective layer comprising an oxide on the surface of the metallic bonding phase of the abrasive grain layer by the sol-gel method. Subsequently, an aerosol obtained by dispersing fine particles of a brittle material in a gas is jetted and caused to strike on the surface of the first protective layer to form a second protective layer comprising a thick oxide film.

Inventors:
YAMASHITA TETSUJI (JP)
RIKITA NAOKI (JP)
KIMURA TAKASHI (JP)
OGYU MASAHARU (JP)
ASHIZAWA HIROAKI (JP)
HATONO HIRONORI (JP)
TOKITA MASAHIRO (JP)
Application Number:
PCT/JP2007/068356
Publication Date:
April 03, 2008
Filing Date:
September 21, 2007
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
TOTO LTD (JP)
YAMASHITA TETSUJI (JP)
RIKITA NAOKI (JP)
KIMURA TAKASHI (JP)
OGYU MASAHARU (JP)
ASHIZAWA HIROAKI (JP)
HATONO HIRONORI (JP)
TOKITA MASAHIRO (JP)
International Classes:
B24B53/12; B24B37/00; B24D3/00; H01L21/304
Foreign References:
JP2003309094A2003-10-31
JPH1058306A1998-03-03
JP2001210613A2001-08-03
JP2005177979A2005-07-07
JP2007109767A2007-04-26
JP2007260886A2007-10-11
Attorney, Agent or Firm:
KOYAMA, Yuu (Furuya Bldg.3-29, Kioicho, Chiyoda-ku, Tokyo 94, JP)
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