Title:
CMP CONDITIONER
Document Type and Number:
WIPO Patent Application WO/2005/095056
Kind Code:
A1
Abstract:
[PROBLEMS] To prevent generation of scratches due to dropping of abrasive grains by stably and firmly fixing the grains, in a CMP conditioner whereupon the abrasive grains are firmly fixed on a protruding part on a base material upper plane, and to ensure a space for holding a grinding liquid between a protruding edge plane of the protruding part on the circumference of the abrasive grain and a pad, at the time of dressing. [MEANS FOR SOLVING PROBLEMS] The CMP conditioner is provided by forming the protruding parts (3, 4), which protrude from the upper plane (2) of the base material (1) rotating in an axis line rotating direction on the upper plane (2), and firmly fixing a plurality of grinding grains (5) on the protruding parts (3, 4). The grinding grains (5) are firmly fixed on the protruding edge planes (3A, 4A) facing the protruding direction of the protruding parts (3,4), so as not to be protruded from a virtual extension plane (P) extended in the axis line direction from circumferences (3C, 4C) of the protruding planes (3A, 4A).
Inventors:
IIYOSHI HIROSHI (JP)
KIMURA TAKASHI (JP)
KOYAMA TUGUHISA (JP)
IIZUKA HIROAKI (JP)
KIMURA TAKASHI (JP)
KOYAMA TUGUHISA (JP)
IIZUKA HIROAKI (JP)
Application Number:
PCT/JP2005/005926
Publication Date:
October 13, 2005
Filing Date:
March 29, 2005
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
IIYOSHI HIROSHI (JP)
KIMURA TAKASHI (JP)
KOYAMA TUGUHISA (JP)
IIZUKA HIROAKI (JP)
IIYOSHI HIROSHI (JP)
KIMURA TAKASHI (JP)
KOYAMA TUGUHISA (JP)
IIZUKA HIROAKI (JP)
International Classes:
B24B53/007; B24B53/12; B24D3/00; B24D7/00; H01L21/304; (IPC1-7): B24B53/12; H01L21/304
Foreign References:
| JP2002326165A | 2002-11-12 | |||
| JPH09225827A | 1997-09-02 | |||
| JP2002331460A | 2002-11-19 | |||
| JP2001071269A | 2001-03-21 | |||
| JP2004025377A | 2004-01-29 |
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