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Patent Searching and Data


Title:
CMP PAD CONDITIONER AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2012/033287
Kind Code:
A9
Abstract:
Provided is a chemical mechanical polishing (CMP) pad conditioner including: a substrate including a plurality of protrusions formed on at least one surface thereof and made of ceramic or hard metal alloy, the plurality of protrusions being formed through laser processing so as not to have angled edges on an upper end and an inclined side thereof; and a diamond thin film deposited so as to cover the plurality of protrusions, wherein the diamond thin film includes a rough polishing surface on which micro protrusions having a size of several ㎛ are formed.

Inventors:
KIM BYUNG KI (KR)
SONG JUN HO (KR)
JUNG YOUN WOONG (KR)
KIM JEONG (KR)
PARK MUN SEAK (KR)
CHEONG KEE JEONG (KR)
KIM SHIN KYUNG (KR)
Application Number:
PCT/KR2011/005871
Publication Date:
June 28, 2012
Filing Date:
August 11, 2011
Export Citation:
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Assignee:
SHINHAN DIAMOND IND CO LTD (KR)
KIM BYUNG KI (KR)
SONG JUN HO (KR)
JUNG YOUN WOONG (KR)
KIM JEONG (KR)
PARK MUN SEAK (KR)
CHEONG KEE JEONG (KR)
KIM SHIN KYUNG (KR)
International Classes:
H01L21/302
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (823-14 Yeoksam-dong Gangnam-gu, Seoul 135-933, KR)
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Claims: