CMP PAD CONDITIONER AND METHOD OF MANUFACTURING THE SAME

Title:

CMP PAD CONDITIONER AND METHOD OF MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2013/032089

Kind Code:

A1

Abstract:

A CMP pad conditioner is disclosed. The CMP pad conditioner includes a disk-shaped base substrate having a main surface, and an abrasive grain portion formed on the main surface. The main surface has a planar portion and a slant portion at an outer edge of the planar portion. The abrasive grain portion has a main abrasive grain portion formed by attaching diamond abrasive grains to the planar portion in a regular arrangement, and an auxiliary abrasive grain portion formed by attaching diamond abrasive grains to the slant portion in a regular arrangement. The slant portion causes the height of the diamond abrasive grains in the auxiliary abrasive grain portion to be gradually lowered.

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Inventors:

KIM SHIN KYUNG (KR)
SONG BRIAN (KR)
PARK MUN SEAK (KR)
KIM KANG JUN (KR)
KIM JEONG (KR)
KIM KYOUNG JIN (KR)
JUNG HYUNG NOH (KR)
IM JANG HYUCK (KR)
PARK SUN WOO (KR)

Application Number:

PCT/KR2012/002205

Publication Date:

March 07, 2013

Filing Date:

March 27, 2012

Export Citation:

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Assignee:

SHINHAN DIAMOND IND CO LTD (KR)
KIM SHIN KYUNG (KR)
SONG BRIAN (KR)
PARK MUN SEAK (KR)
KIM KANG JUN (KR)
KIM JEONG (KR)
KIM KYOUNG JIN (KR)
JUNG HYUNG NOH (KR)
IM JANG HYUCK (KR)
PARK SUN WOO (KR)

International Classes:

H01L21/304

Foreign References:

JP2001113456A	2001-04-24
KR20090078647A	2009-07-20
JP2007245254A	2007-09-27
JP2005313310A	2005-11-10

Attorney, Agent or Firm:

AIP PATENT & LAW FIRM (823-14 Yeoksam-dong, Gangnam-gu, Seoul 135-933, KR)

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