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Title:
CMP POLISHING AGENT, ADDITIVE SOLUTION FOR CMP POLISHING AGENT, AND METHOD FOR POLISHING SUBSTRATE BY USING THE POLISHING AGENT AND THE ADDITIVE SOLUTION
Document Type and Number:
WIPO Patent Application WO/2008/032794
Kind Code:
A1
Abstract:
Disclosed are: a CMP polishing agent comprising a cerium oxide particle, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer comprises a polymer produced by polymerizing a monomer comprising at least one of a carboxylic acid having an unsaturated double bond and a salt thereof by using a reductive inorganic acid salt and oxygen as redox polymerization initiators; an additive solution for the CMP polishing agent; and a method for polishing a substrate by using the CMP polishing agent and the additive solution. It becomes possible to achieve the polishing of a silicon oxide film with efficiency in the CMP technique for planarizing an interlayer insulating film, a BPSG film or an insulating film for the Shallow-Trench isolation.

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Inventors:
FUKASAWA MASATO
YAMAGISHI CHIAKI
KIMURA TADAHIRO
AKUTSU TOSHIAKI
Application Number:
PCT/JP2007/067863
Publication Date:
March 20, 2008
Filing Date:
September 13, 2007
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
FUKASAWA MASATO
YAMAGISHI CHIAKI
KIMURA TADAHIRO
AKUTSU TOSHIAKI
International Classes:
B24B37/04; C09K3/14; H01L21/304
Domestic Patent References:
WO2006035779A12006-04-06
Foreign References:
JP2000031102A2000-01-28
JP2001358100A2001-12-26
JPH10106994A1998-04-24
JPH0822970A1996-01-23
JP2006250822A2006-09-21
JP2000031102A2000-01-28
JPS5655407A1981-05-16
Other References:
See also references of EP 2090400A4
THE SOCIETY OF CHEMICAL ENGINEERS, JAPAN, vol. 6, no. 5, 1980, pages 527 - 532
POLYMER PREPRINTS, JAPAN, vol. 36, no. 6, 1987, pages 1601 - 1603
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (2-8 Toranomon 1-chome,Minato-k, Tokyo 01, JP)
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