Title:
CMP POLISHING FLUID FOR POLISHING PALLADIUM AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/077887
Kind Code:
A1
Abstract:
The disclosed CMP polishing fluid for polishing palladium contains 1,2,4-triazole, phosphoric acids, an oxidizing agent, and abrasive particles having a degree of association of at least 1.5 to less than 2.5. The disclosed polishing method is a method for polishing a substrate and involves polishing the substrate with a polishing cloth while supplying a CMP polishing fluid between the substrate and the polishing cloth. The substrate has a palladium layer on the surface facing the polishing cloth, and the CMP polishing fluid is a CMP polishing fluid for polishing palladium and contains 1,2,4-triazole, phosphoric acids, an oxidizing agent, and abrasive particles having a degree of association of at least 1.5 to less than 2.5.
Inventors:
MINAMI Hisataka (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
南 久貴 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
南 久貴 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
Application Number:
JP2010/070929
Publication Date:
June 30, 2011
Filing Date:
November 24, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
MINAMI Hisataka (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
MINAMI Hisataka (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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