Title:
CMP POLISHING LIQUID AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/098817
Kind Code:
A1
Abstract:
A CMP polishing liquid that is used to polish a surface to be polished that has at least a cobalt-containing section and a metal-containing section that contains a metal that is not cobalt. The CMP polishing liquid contains polishing particles, two types of metal corrosion inhibitors, and water, and has a pH of 4.0 or less. The two types of metal corrosion inhibitors are both azoles (excluding salts of inorganic acids).
Inventors:
SAKASHITA MASAHIRO (JP)
OTSUKA YUYA (JP)
OTSUKA YUYA (JP)
Application Number:
PCT/JP2015/085246
Publication Date:
June 23, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
| JP2012182158A | 2012-09-20 | |||
| JP2011091248A | 2011-05-06 | |||
| JP2013042123A | 2013-02-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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