Title:
A CMP POLISHING PAD INCLUDING A SOLID CATALYST
Document Type and Number:
WIPO Patent Application WO2002057382
Kind Code:
A3
Abstract:
A polishing pad comprising a polishing pad substrate and at least one solid catalyst, the polishing pad being useful to remove metal layers from a substrate.
Inventors:
MUELLER BRIAN L
WANG SHUMIN
WANG SHUMIN
Application Number:
PCT/US2002/001210
Publication Date:
October 31, 2002
Filing Date:
January 16, 2002
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
International Classes:
B24B37/24; B24D3/00; B24D3/02; B24D3/34; C09G1/02; C09K3/14; C23F3/00; H01L21/304; H01L21/321; (IPC1-7): C09G1/02; B24B37/04; C09K3/14; H01L21/321
Domestic Patent References:
| WO1999061540A1 | 1999-12-02 |
Foreign References:
| US4927432A | 1990-05-22 | |||
| US6030425A | 2000-02-29 |
Download PDF:
Previous Patent: METHOD OF PREPARING A LACQUER COMPOSITION
Next Patent: PRESSURE SENSITIVE ADHESIVES WITH A FIBROUS REINFORCING MATERIAL
Next Patent: PRESSURE SENSITIVE ADHESIVES WITH A FIBROUS REINFORCING MATERIAL