Title:
CMP POLISHING PAD WITH PORES FORMED THEREIN, AND METHOD FOR FORMING PORES
Document Type and Number:
WIPO Patent Application WO/2011/002149
Kind Code:
A2
Abstract:
The present invention relates to a CMP polishing pad with pores formed therein, wherein the pores are formed in the CMP polishing pad using a laser by setting the focal point of the laser beam inside the CMP polishing pad. When pores are formed in a CMP polishing pad according to the method for forming pores of the present invention, a CMP polishing pad having excellent slurry-retaining characteristics can be manufactured because the polishing pad has a low hardness. Also, by forming pores through laser processing, the size and arrangement of pores can be freely controlled, such that the uniformity of CMP processing can be improved, and custom CMP polishing pads can be manufactured in accordance with the material to be CMP processed or with the process type.
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Inventors:
KIM, Chil Min (#1304, GardenSuite Mock 5-dong, Yangcheon-gu, Seoul 158-055, 158-055, KR)
Application Number:
KR2010/002729
Publication Date:
January 06, 2011
Filing Date:
April 30, 2010
Export Citation:
Assignee:
INDUSTRY-UNIVERSITY COOPERATION FOUNDATION SOGANG UNIVERSITY (1 Sinsu-dong, Mapo-gu, Seoul 121-742, 121-742, KR)
서강대학교 산학협력단 (대한민국 서울특별시 마포구 신수동 1, 121-742 Seoul, 121-742, KR)
서강대학교 산학협력단 (대한민국 서울특별시 마포구 신수동 1, 121-742 Seoul, 121-742, KR)
International Classes:
B23K26/38; B23K26/04; B24B37/04; H01L21/304
Attorney, Agent or Firm:
J.C.HYUN PATENT & LAW FIRM (Dooji Bldg. 4f, 353-18 Shindang 2-dong, Jung-gu, Seoul 100-828, 100-828, KR)
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