Title:
CMP SLURRY COMPOSITION FOR POLISHING COPPER, AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/195968
Kind Code:
A1
Abstract:
The present invention relates to: a CMP slurry composition for polishing copper, containing an oxidizing agent, a corrosion inhibitor, a chelating agent, a solvent, and a copolymer of (meth)acrylic acid and a (meth)acrylamide compound, which has an azole substituent; and a polishing method using the same.
Inventors:
SHIN NA YOOL (KR)
KIM WON JUNG (KR)
DO KEUN BONG (KR)
HWANG KI WOOK (KR)
KIM WON JUNG (KR)
DO KEUN BONG (KR)
HWANG KI WOOK (KR)
Application Number:
PCT/KR2017/001379
Publication Date:
November 16, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
SAMSUNG SDI CO LTD (KR)
International Classes:
C09G1/02; C09K3/14; C23F3/04; H01L21/304; H01L21/321
Foreign References:
| KR101044304B1 | 2011-06-29 | |||
| KR20100077802A | 2010-07-08 | |||
| KR101091501B1 | 2011-12-08 | |||
| KR20090059109A | 2009-06-10 | |||
| JP2013197526A | 2013-09-30 |
Attorney, Agent or Firm:
AJU INT'L LAW & PATENT GROUP (KR)
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