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Title:
CO-INJECTION-MOLDED MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/074445
Kind Code:
A1
Abstract:
Provided is a co-injection-molded multilayer structure having a barrier layer and outer layers layered in contact therewith on both sides thereof, wherein the barrier layer comprises a resin composition including an ethylene-vinyl alcohol copolymer (A) and an alkali metal salt (B) of a higher fatty acid having a melting point of 250°C or lower, the content of the alkali metal salt (B) in the barrier layer is 50-1500 ppm, and the outer layers comprise a resin composition including an unmodified polypropylene (E) and an anhydrous maleic-acid-modified polypropylene (F) having a lower melt viscosity than the unmodified polypropylene (E). The co-injection-molded multilayer structure has excellent adhesion of the barrier layer comprising an EVOH resin composition and the outer layers comprising a polypropylene resin composition, despite not having an adhesive layer.

Inventors:
CHOW EDGARD (US)
MEDLOCK GENE (US)
HIROSE WATARU (US)
Application Number:
PCT/JP2017/037461
Publication Date:
April 26, 2018
Filing Date:
October 17, 2017
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
B32B27/28; B29C45/16; B29K23/00; B29K29/00; B29L9/00
Domestic Patent References:
WO2015141610A12015-09-24
WO2000063085A12000-10-26
WO2011038886A12011-04-07
WO2007126157A12007-11-08
Foreign References:
JP2007536114A2007-12-13
JP2012502175A2012-01-26
JP2012193328A2012-10-11
JP2014051319A2014-03-20
JP2000063683A2000-02-29
Other References:
See also references of EP 3527370A4
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
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