COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2011/002065

A1

Disclosed are conductive particles which are capable of providing an anisotropically conductive adhesive that is able to maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a fine circuit, while having excellent moisture absorption resistance. The conductive particles can be obtained at a lower cost. Specifically disclosed is a coated conductive particle (5) which comprises: a composite conductive particle (3) that has a resin particle (4) and a metal layer (6) that covers the resin particle (4); and an insulating fine particle (1) that is arranged outside the metal layer (6) so as to partially cover the surface of the metal layer (6). The metal layer (6) has a nickel-palladium alloy plating layer (6a).

TAKAI Kenji (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
高井　健次 (〒47 茨城県つくば市和台４８　日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
EJIRI Yoshinori (1500, Ogawa, Chikusei-sh, Ibaraki 21, 〒3088521, JP)
江尻　芳則 (〒21 茨城県筑西市小川１５００番地　日立化成工業株式会社内 Ibaraki, 〒3088521, JP)

JP2010/061267

January 06, 2011

July 01, 2010

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HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishi-Shinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
TAKAI Kenji (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
高井　健次 (〒47 茨城県つくば市和台４８　日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
EJIRI Yoshinori (1500, Ogawa, Chikusei-sh, Ibaraki 21, 〒3088521, JP)

H01R11/01; H01B5/00; H01B13/00

HASEGAWA, Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl.1-1, Marunouchi 2-chom, Chiyoda-ku Tokyo 05, 〒1000005, JP)

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