Title:
COATED DIE FOR USE IN HOT STAMPING
Document Type and Number:
WIPO Patent Application WO/2020/116291
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a coated die which, used in hot stamping, has both adhesion resistance in the initial processing stage and abrasion resistance in the intermediate processing stage. This coated die for use in hot stamping comprises a hard film on the work surface, wherein the hard film has an alternating layer section formed by alternating lamination of a1 layers, formed from nitride in which the metal portion including semimetals are at least 30% chromium by atomic ratio, and a2 layers, formed from nitride in which the metal portions including semimetals are at least 50% vanadium by atomic ratio. Defining ta1 and ta2 as the thickness of the a1 layers and the a2 layers respectively, and defining the film thickness ratio Xb as the film thickness ratio ta2/ta1 of a1 layers and a2 layers adjacent to each other in the substrate-side region of the alternating layer section and the film thickness ratio Xt as the film thickness ratio ta2/ta1 of a1 layers and a2 layers adjacent to each other in the outermost region of the alternating layer section, it holds that Xt > Xb.
Inventors:
SHOUJI TATSUYA (JP)
Application Number:
PCT/JP2019/046461
Publication Date:
June 11, 2020
Filing Date:
November 27, 2019
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
B21D37/01
Domestic Patent References:
| WO2013047548A1 | 2013-04-04 |
Foreign References:
| JP2008207219A | 2008-09-11 |
Download PDF:
Previous Patent: TABLE PROJECTION DEVICE
Next Patent: IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD
Next Patent: IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD