COATED SILVER NANOPARTICLES AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2010/119630

A1

Provided is a conductive molding material, comprising coated silver nanoparticles, that can be sintered at a low temperature and used even on flexible printed substrates which have low heat-resistance. Also provided is a method for manufacturing said coated silver nanoparticles, which are coated in protective amine molecules, are no more than 30 nm in diameter, and are characterized by a loss in weight, upon thermogravimetric measurement, of at least 30% at 160°C. The coated silver nanoparticles are further characterized by forming a silver-colored sintered film upon sintering at a temperature of no more than 100°C for no more than 1 hour. The nanoparticles are prepared in the following way: alkylamine and alkyldiamine are mixed with a silver compound which breaks down and generates metallic silver upon heating; this forms a complex compound which is then heated, causing thermal decomposition of the silver compound.

KURIHARA, Masato (1-4-12 Kojirakawa-machi, Yamagata-sh, Yamagata 60, 〒9908560, JP)
栗原正人 (〒60 山形県山形市小白川町一丁目４番１２号　国立大学法人山形大学内 Yamagata, 〒9908560, JP)

JP2010/002381

October 21, 2010

March 31, 2010

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Yamagata University (1-4-12, Kojirakawa-machi Yamagata-sh, Yamagata 60, 〒9908560, JP)
国立大学法人山形大学 (〒60 山形県山形市小白川町一丁目４番１２号 Yamagata, 〒9908560, JP)
KURIHARA, Masato (1-4-12 Kojirakawa-machi, Yamagata-sh, Yamagata 60, 〒9908560, JP)

B22F9/30; B22F9/00; H01B5/14; H01B13/00

SHIGA, Masatake et al. (1-9-2, Marunouchi Chiyoda-ku, Tokyo 20, 〒1006620, JP)

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