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Title:
COATING AGENT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE USING SAID COATING AGENT
Document Type and Number:
WIPO Patent Application WO/2020/116539
Kind Code:
A1
Abstract:
Provided is a coating agent capable of: forming a coating layer having uniform heat insulating properties; and suppressing damage to an electronic component, said damage being caused by partial re-melting of solder or thermal expansion of a resin. A coating agent according to the present invention includes (A) a thermoplastic resin, (B) an organic solvent, (C) a thixotropic agent, and (D) hollow particles.

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Inventors:
KUROZUMI SATORU (JP)
INOUE MASAO (JP)
Application Number:
PCT/JP2019/047522
Publication Date:
June 11, 2020
Filing Date:
December 04, 2019
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/29; C09D7/63; C09D7/65; C09D201/00; H01L21/56; H01L23/31; H05K3/28
Domestic Patent References:
WO2017038343A12017-03-09
Foreign References:
JPS60179474A1985-09-13
JP2015172142A2015-10-01
JP2016141174A2016-08-08
JP2013125755A2013-06-24
JP2012151296A2012-08-09
JP2013131559A2013-07-04
Other References:
See also references of EP 3893273A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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