Title:
COATING APPARATUS AND COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/120145
Kind Code:
A1
Abstract:
Provided is a coating apparatus with which it is possible to suppress formation of unevenness in coating and form a coating film having a uniform thickness even in the case when foreign matter is present between a stage and a substrate. Specifically, the coating apparatus comprises: a stage on which a substrate is to be placed; and a coating unit which forms a coating film on the substrate being placed on the surface of the stage, by discharging a coating liquid onto the substrate while moving in one direction relative to the substrate. The stage has: an exclusion area holding part which suctions and holds an exclusion area that is other than a coating area of the substrate where a coating film is to be formed; and a coating area holding part which suctions and holds the coating area. The exclusion area holding part is provided so as to enclose the coating area, and is so formed as to be capable of holding the substrate on the stage in a state where the coating area holding part is disabled.
Inventors:
HAMAKAWA KENJI (JP)
HORIUCHI NOBUO (JP)
HORIUCHI NOBUO (JP)
Application Number:
PCT/JP2022/044796
Publication Date:
June 29, 2023
Filing Date:
December 05, 2022
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05C13/00; B05C5/02; B05D1/26; B05D3/00; B05D3/12
Foreign References:
| JPH1073796A | 1998-03-17 | |||
| JP2017148761A | 2017-08-31 | |||
| JP2014236016A | 2014-12-15 | |||
| JP2006068592A | 2006-03-16 |
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