Title:
COATING APPLICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/043554
Kind Code:
A1
Abstract:
Provided is a coating application method whereby a coating application pattern can be formed in accordance with a shape set in advance. Specifically, the present invention is a coating application method comprising applying a coating liquid in an entire pattern region formed on a substrate and forming a coating application pattern having the shape of the pattern region 52, the periphery of the pattern region 52 having lower lyophilic properties than the pattern region 52, and liquid repellent parts 54 being provided inside the pattern region 52, the liquid repellent parts 54 having lower lyophilic properties than the remaining portion of the inside of the pattern region 52.
More Like This:
Inventors:
SHIMATANI KENICHI (JP)
TOMOEDA SATOSHI (JP)
TOMOEDA SATOSHI (JP)
Application Number:
PCT/JP2016/076370
Publication Date:
March 16, 2017
Filing Date:
September 08, 2016
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05D1/26; B05D3/06
Foreign References:
JP2004349639A | 2004-12-09 | |||
JP2013223854A | 2013-10-31 | |||
JP2004089878A | 2004-03-25 | |||
JP2009006295A | 2009-01-15 |
Download PDF:
Previous Patent: DIENE POLYMER, METHOD FOR PRODUCING DIENE POLYMER, AND RUBBER COMPOSITION
Next Patent: SUPERCONDUCTING WIRE ROD BONDING METHOD
Next Patent: SUPERCONDUCTING WIRE ROD BONDING METHOD