COATING FILM FORMING DEVICE, COATING FILM FORMING METHOD, AND STORAGE MEDIUM

WIPO Patent Application WO/2017/195549

A1

[Problem] To provide technology that can suppress mixing in of bubbles in a coating film in the formation of a coating film on a substrate. [Solution] Processing is performed so as to execute: a first step for supplying a coating liquid to a substrate and locally forming a liquid puddle A1 in a center part of the substrate; a second step for next supplying a diluent to the peripheral part of the liquid puddle A1 and forming a mixed liquid A2; and a third step for next rotating the substrate, spreading the mixed liquid A2 toward the peripheral edge parts of the substrate by centrifugal force, to coat the peripheral edge parts of the substrate with the mixed liquid A2, and spreading the puddle toward the peripheral edge parts of the substrate coated by the mixed liquid A2 to form a coating film.

JPH0654389	[Title of Invention] Positive Radiation Sensitive Resin Composition
WO/2005/081295	EXPOSURE METHOD, EXPOSURE APPARATUS, EXPOSURE SYSTEM AND METHOD FOR MANUFACTURING DEVICE
JP2004259757	METHOD FOR OPTIMIZING FILM FORMING TIME AND OPTIMIZING SYSTEM OF FILM FORMING TIME

SHIBATA NAOKI (JP)
HATAKEYAMA SHINICHI (JP)

PCT/JP2017/015718

November 16, 2017

April 19, 2017

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TOKYO ELECTRON LTD (JP)

H01L21/027; B05C11/08; B05C11/10; B05D1/40; G03F7/16

JP2008307488A	2008-12-25
JP2000155424A	2000-06-06
JP2002158162A	2002-05-31
JP2007058200A	2007-03-08
JP2003136010A	2003-05-13
JP2015211066A	2015-11-24
JP2010253403A	2010-11-11
JP2009279476A	2009-12-03
JP2015153857A	2015-08-24

INOUE, Toshio et al. (JP)

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