Title:
COATING FILM PEELING METHOD AND COATING FILM PEELING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/218811
Kind Code:
A1
Abstract:
The present invention provides a coating film peeling method and a coating film peeling device with which it is possible to efficiently and reliably peel a coating film from a base film having a coating film, using a washing solution. A method for peeling a coating film from a base film having a coating film according to the present invention is for peeling a coating film from a base film having a coating film which has a coating film containing a water-soluble resin, and is characterized in that a washing solution is applied in a range of 3-650 mL/m2 to the surface of the coating film, then, while bringing a peeling member into direct contact with the coating film surface of the base film having a coating film and while making the angle formed by the base film via the peeling member be in the range of 20-150° and applying tension in the range of 10-1000 N/m in at least one longitudinal direction of the base film, moving the base film in the longitudinal direction of the base film relative to the peeling member to peel away the coating layer containing the washing solution.
Inventors:
TANINO KIYOSHI (JP)
SUZUKI TADAMASA (JP)
HIGASHIDA YOSHIHISA (JP)
WATANABE KAZUTAKA (JP)
SUZUKI TADAMASA (JP)
HIGASHIDA YOSHIHISA (JP)
WATANABE KAZUTAKA (JP)
Application Number:
PCT/JP2023/014111
Publication Date:
November 16, 2023
Filing Date:
April 05, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B29B17/02; C08J11/06
Foreign References:
| JP2004169005A | 2004-06-17 | |||
| JP2001259538A | 2001-09-25 | |||
| JP2001179741A | 2001-07-03 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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