COATING MATERIAL AND MOLDED RESIN WITH COATING LAYER

Title:

COATING MATERIAL AND MOLDED RESIN WITH COATING LAYER

Document Type and Number:

WIPO Patent Application WO/2000/006654

Kind Code:

A1

Abstract:

A coating material comprising 50 to 99 parts by weight of a monomer mixture (M) comprising 50 to 100 wt.% polyfunctional (meth)acrylate monomer (m-1) having two or more (meth)acryloyloxy groups and 0 to 50 wt.% monofunctional (meth)acrylic monomer (m-2) and 1 to 50 parts by weight of colloidal silica in which 5 to 100 wt.% of all the silica particles are accounted for by rod-shaped silica particles having an average thickness of 5 to 20 nm and an average length of 40 to 300 nm; and a molded resin having a coating layer formed by curing the coating material. This coating material is excellent in appearance, hardness, wearing resistance, weatherability, adhesion to substrates, freedom from solvents, etc.

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Inventors:

SUGAMOTO HIDEYUKI (JP)
KAWAI OSAMU (JP)
SAWANO TETSUYA (JP)

Application Number:

PCT/JP1999/003906

Publication Date:

February 10, 2000

Filing Date:

July 22, 1999

Export Citation:

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Assignee:

MITSUBISHI RAYON CO (JP)
SUGAMOTO HIDEYUKI (JP)
KAWAI OSAMU (JP)
SAWANO TETSUYA (JP)

International Classes:

C08F283/00; C08F290/06; C08F290/14; C09D4/02; C09D4/06; C08F222/10; (IPC1-7): C09D4/00

Foreign References:

JPH01317115A	1989-12-21
JPH04187512A	1992-07-06
JPH07118008A	1995-05-09
JPH0356514A	1991-03-12
JPS57131214A	1982-08-14
JPH05179157A	1993-07-20
JPH08114915A	1996-05-07
JPH05297588A	1993-11-12

Other References: