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Patent Searching and Data


Title:
COATING MATERIALS
Document Type and Number:
WIPO Patent Application WO/2001/055272
Kind Code:
A1
Abstract:
Coating materials excellent in lubricity, mold release characteristics, water repellency, heat resistance, and so on, and capable of forming films excellent in tight adhesion to substrates. Specifically, (1) a coating material comprising a copolymer composed of silicone units, cyclic imido monomer units and other monomer units, and (2) a coating material comprising (a) a copolymer composed of silicone units, cyclic imido monomer units and other monomer units and (b) a compound having one or more (meth)acryloyl groups and a number-average molecular weight of 100 to 5,000.

Inventors:
Kamiya, Daisuke (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
Maeda, Keiji (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
Okazaki, Eiichi (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
Application Number:
PCT/JP2001/000350
Publication Date:
August 02, 2001
Filing Date:
January 19, 2001
Export Citation:
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Assignee:
TOAGOSEI CO., LTD. (14-1, Nishishimbashi 1-chome Minato-ku Tokyo, 105-0003, JP)
Kamiya, Daisuke (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
Maeda, Keiji (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
Okazaki, Eiichi (Toagosei Co, Ltd. Nagoya Research & Development Institute 1-1 Funamicho Minato-ku, Nagoya-shi Aichi, 455-0027, JP)
International Classes:
C08F290/06; C08F220/52; C08F299/00; C09D4/06; C09D133/14; C09D135/00; C09D143/04; C09D157/06; B41M5/40; B41M5/44; (IPC1-7): C09D183/04; B41M5/40; C09D4/06; C09D133/06; C09D135/00
Foreign References:
EP0283204A2
EP0877037A1
JPH07179816A
JPH11286623A
JPH03296515A
Attorney, Agent or Firm:
Oguri, Shohei (Eikoh Patent Office 28th Floor, ARK Mori Building 12-32, Akasaka 1-chome Minato-ku Tokyo, 107-6028, JP)
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