Title:
COATING METHOD, COATING DEVICE, AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2018/037691
Kind Code:
A1
Abstract:
[Problem] To more reliably suppress a coating film defect by removing particles in a short time when a wafer is to be coated with coating liquid.
[Solution] Before a coating liquid 102 is supplied to a wafer W loaded into a coating device, thinner 100 is supplied, a surface of the wafer W is wetted, and then the surface of the wafer W is dried. In this way, the flow of particles 101 on the surface of the wafer W is facilitated. Due to the drying of the surface of the wafer W, when the thinner 100 is subsequently supplied to the surface of the wafer W, the cross section of the gas-liquid interface of a liquid accumulation of thinner becomes rounded, making it possible to push the particles 101 with greater force and to more reliably remove the particles 101 in a short time. Accordingly, when the wafer W is subsequently coated with the coating liquid 102, the formation of comet-shaped mottling on a SOC film due to the attachment of the particles 101 can be suppressed.
Inventors:
GOTO HIROFUMI (JP)
KUBOTA MINORU (JP)
KYOUDA HIDEHARU (JP)
KUBOTA MINORU (JP)
KYOUDA HIDEHARU (JP)
Application Number:
PCT/JP2017/022836
Publication Date:
March 01, 2018
Filing Date:
June 21, 2017
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05C11/08; B05D1/40
Domestic Patent References:
| WO2005050724A1 | 2005-06-02 |
Foreign References:
| JP2003086491A | 2003-03-20 | |||
| JP2007234964A | 2007-09-13 | |||
| JP2012231116A | 2012-11-22 | |||
| JP2010207788A | 2010-09-24 |
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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