COATING METHOD

WIPO Patent Application WO/2016/152308

A1

In the present invention, a substrate W is rotated by a retention and rotation section 2 and the substrate W is coated with a coating liquid film RS; in addition, at least a part of excess coating liquid RS is pushed away toward a marginal section E of the substrate W by centrifugal force in association with the rotation of the substrate W, causing excess coating liquid RS to accumulate along the marginal section E of the substrate W. A gas GS is then blown toward the marginal section E of the substrate W by a gas nozzle 4, and the excess coating liquid RS accumulating at the marginal section E is ejected to the outside of the substrate W. The blowing of the gas GS toward the marginal section E of the substrate W by the gas nozzle 4 makes it possible to break a state of equilibrium of the coating liquid RS remaining and accumulating due to surface tension without being ejected to the outside of the substrate W. Therefore, the rotation makes it possible to achieve a uniform thickness of the coating liquid film RS even when a thick coating liquid film RS is being formed.

HARUMOTO MASAHIKO (JP)
TANAKA YUJI (JP)

PCT/JP2016/054173

September 29, 2016

February 12, 2016

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SCREEN HOLDINGS CO LTD (JP)

B05D1/40; B05D3/04; H01L21/027

JP2011036847A	2011-02-24
JP2010099589A	2010-05-06
JPH06283417A	1994-10-07
JP2003037053A	2003-02-07
JPH09106980A	1997-04-22
JPS6213029A	1987-01-21
JPS6447474A	1989-02-21
JPH05266472A	1993-10-15
JP2010164871A	2010-07-29
JP2001110712A	2001-04-20

SUGITANI Tsutomu (JP)
Tsutomu Sugitani (JP)

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