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Patent Searching and Data


Title:
COATING PROCESS DEVICE, COATING PROCESS METHOD AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2013/065470
Kind Code:
A1
Abstract:
The invention is a coating process device that applies a coating fluid onto a substrate by forming a pool of the coating fluid that has been discharged from a discharge opening of an application nozzle, said pool being formed between the substrate and the discharge opening, and in said state, moving the substrate and the application nozzle relative to each other in a horizontal direction. Said coating process device comprises: an application nozzle that communicates with the discharge opening, and is provided with a storage chamber that stores the coating fluid therein; a pressure adjustment mechanism that adjusts the pressure inside the storage chamber; and a control section configured to control the pressure adjustment mechanism, and while applying coating fluid to the substrate surface, to adjust the pressure within the storage chamber such that the discharge rate of the coating fluid from the discharge opening is constant.

Inventors:
ISHII TAKAYUKI (JP)
SAKAMOTO TAKAHIRO (JP)
KITANO TAKAHIRO (JP)
Application Number:
PCT/JP2012/076431
Publication Date:
May 10, 2013
Filing Date:
October 12, 2012
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05D1/26; B05C5/02; B05C11/10
Foreign References:
JP2001062368A2001-03-13
JP2004014393A2004-01-15
JPH11197572A1999-07-27
JPH0461958A1992-02-27
JP2001121062A2001-05-08
JP2009125726A2009-06-11
JPH0994508A1997-04-08
JP2010284627A2010-12-24
JPH09164357A1997-06-24
JPH1099764A1998-04-21
JPH10113595A1998-05-06
JP2000157907A2000-06-13
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
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Claims: