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Title:
COAXIAL VIA CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2007/138895
Kind Code:
A1
Abstract:
A coaxial via connecting structure is provided with a shield electrode wall (11) having a height corresponding to coaxial lines of upper and lower layers; a lower layer connecting opening section (12a) at a position corresponding to the coaxial line on the lower layer on the shield electrode wall (11); an upper layer connecting opening section (12b) at a position corresponding to the coaxial line on the upper layer on the shield electrode wall (11); and a signal line (13) connecting between the lower layer connecting opening section (12a) and the upper layer connecting opening section (12b) in the shield electrode wall (11). The coaxial via connecting structure is arranged at a position where the coaxial lines of the upper and lower layers intersect with each other, and connects the coaxial line of the lower layer positioned at the lower layer connecting opening section (12a) with the coaxial line of the upper layer positioned at the upper layer connecting opening section (12b) by using a signal line (13).

Inventors:
AOYAGI MASAHIRO (JP)
NAKAGAWA HIROSHI (JP)
KIKUCHI KATSUYA (JP)
YOKOSHIMA TOKIHIKO (JP)
YAMAJI YASUHIRO (JP)
Application Number:
PCT/JP2007/060270
Publication Date:
December 06, 2007
Filing Date:
May 18, 2007
Export Citation:
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Assignee:
NAT INST OF ADVANCED IND SCIEN (JP)
AOYAGI MASAHIRO (JP)
NAKAGAWA HIROSHI (JP)
KIKUCHI KATSUYA (JP)
YOKOSHIMA TOKIHIKO (JP)
YAMAJI YASUHIRO (JP)
International Classes:
H05K3/46; H05K1/02
Foreign References:
JPS61239701A1986-10-25
JP2004023037A2004-01-22
JPH04267586A1992-09-24
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