Title:
COF TYPE SEMICONDUCTOR PACKAGE AND LIQUID CRYSTAL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/121579
Kind Code:
A1
Abstract:
A COF type semiconductor package according to one embodiment of the present invention is provided with: a film; a chip that is bonded on the film; and a heat emission sheet that is provided on the chip and sequentially comprises an adhesive layer, a metal layer, a heat emission layer that contains a heat emission filler and a binder, and an insulating layer.
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Inventors:
NAKANISHI KENICHI (JP)
IKEYA TATSUHIRO (JP)
ARAI YOSHIKAZU (JP)
IKEYA TATSUHIRO (JP)
ARAI YOSHIKAZU (JP)
Application Number:
PCT/JP2016/051464
Publication Date:
August 04, 2016
Filing Date:
January 19, 2016
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01L23/373; B32B9/00; B32B15/20; G02F1/1368; G09F9/00
Foreign References:
| JP2007180574A | 2007-07-12 | |||
| JP2014160718A | 2014-09-04 | |||
| JP2008028396A | 2008-02-07 | |||
| JPH02295733A | 1990-12-06 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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