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Patent Searching and Data


Title:
COIL ASSEMBLY AND CIRCUIT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/104561
Kind Code:
A1
Abstract:
Provided is a coil assembly to be mounted on a circuit board, the coil assembly comprising: a coil that includes a winding part that is made of a rectangular wire and is formed by winding the rectangular wire edgewise, an extending portion that extends from the winding part in the extension direction, a stepped portion that is bent from the extending portion in a direction intersecting with the extension direction, and a connection portion that is bent from the stepped portion in the extension direction; and a protruding part that is provided at a position on the side opposite to the connection portion in the extension direction and that abuts against the circuit board so as to separate a portion of the coil that is on the side opposite to the connection portion in the extension direction from the circuit board.

Inventors:
TSUCHIDA TOSHIYUKI (JP)
Application Number:
PCT/JP2016/086693
Publication Date:
June 22, 2017
Filing Date:
December 09, 2016
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01F37/00; H01F17/04; H01F27/06; H01F27/28; H01F27/32; H05K1/18
Foreign References:
JP2010219473A2010-09-30
JP2013223339A2013-10-28
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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