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Patent Searching and Data


Title:
COIL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2013/108862
Kind Code:
A1
Abstract:
Provided is a coil component having a high inductance value and increased coil-pattern connection reliability, and also able to ensure high common-mode attenuation when constituting a common mode choke coil. This coil component is provided with a first magnetic substrate, a laminate body, and a second magnetic substrate. The coil is formed inside the laminate body. In the coil, a plurality of coil patterns provided on one surface of an insulating layer and a plurality of coil patterns provided on the other surface of the insulating layer are connected in multiple locations through vias. The the portions of coil patterns (8a, 8b, 8c) contacting the vias (9a, 9c, 9e) comprise portions of width (w) having dimensions equivalent to that from the center in the width direction of the coil pattern to both sides in the width direction of the coil pattern. The portions of adjacent coil separated by a gap from the portions having this width comprise portions of width (s) having dimensions equivalent to that from the center in the width direction of the coil pattern to both sides in the width direction of the coil pattern.

Inventors:
ISHIDA KOSUKE (JP)
NISHI KIYOTAKA (JP)
Application Number:
PCT/JP2013/050885
Publication Date:
July 25, 2013
Filing Date:
January 18, 2013
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00
Foreign References:
JP4381417B22009-12-09
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Claims: