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Patent Searching and Data


Title:
COIL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/009241
Kind Code:
A1
Abstract:
This coil device is provided with: a base; a cover, which faces the base, and which forms a housing space between the base and the cover; a housing, which is disposed in the housing space, and which houses the coil therein; a substrate, which is disposed in the housing space, and which has a through hole penetrating in the direction in which the base and the cover face each other; and a supporting column section disposed in the through hole. The supporting column section has strength that is higher than that of the substrate, and the height of the supporting column section is more than the thickness of the substrate.

Inventors:
NISHIMURA KENJI (JP)
Application Number:
PCT/JP2018/025053
Publication Date:
January 10, 2019
Filing Date:
July 02, 2018
Export Citation:
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Assignee:
IHI CORP (JP)
International Classes:
H01F27/02; H01F38/14; H02J50/12; H02J50/60
Domestic Patent References:
WO2013061616A12013-05-02
Foreign References:
US20150367739A12015-12-24
JP2014233107A2014-12-11
JP2014193026A2014-10-06
JP2008017562A2008-01-24
JP2017188662A2017-10-12
Other References:
See also references of EP 3651169A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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