Title:
COIL DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/220744
Kind Code:
A1
Abstract:
This coil device is mounted on an object on which the coil device is to be mounted. The coil device is provided with a housing which contains at least a coil section, and a heat dissipation member which comes into thermal contact with the object on which the coil device is to be mounted. The heat dissipation member includes a body section which is disposed in at least part of the region between the housing and the object on which the coil device has been mounted, and a protrusion which protrudes from the body section toward the object on which the coil device has been mounted.
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Inventors:
KIM TAEWON (JP)
NISHIMURA KENJI (JP)
NISHIMURA KENJI (JP)
Application Number:
PCT/JP2019/008437
Publication Date:
November 21, 2019
Filing Date:
March 04, 2019
Export Citation:
Assignee:
IHI CORP (JP)
International Classes:
H01F27/28; H01F27/22; H01F38/14
Domestic Patent References:
| WO2016194739A1 | 2016-12-08 |
Foreign References:
| JP2015153929A | 2015-08-24 | |||
| JP2012044049A | 2012-03-01 | |||
| JP2016076636A | 2016-05-12 | |||
| JP2013147142A | 2013-08-01 | |||
| JP2016171238A | 2016-09-23 | |||
| JP2016143773A | 2016-08-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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