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Patent Searching and Data


Title:
COIL ELEMENT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/068612
Kind Code:
A1
Abstract:
Provided is a production method for a coil element, whereby a resin mold can be used and the thickness of the coil element can be reduced without peeling away or transfer. The production method for the coil element uses a resin mold capable of being dissolved in an organic solvent, said method having: a step in which the resin mold having an inverse coil element pattern stamped on the surface thereof is prepared; a step in which a metal seed film is formed on the surface of the resin mold; a step in which the metal seed film in an area having no inverse coil element pattern formed therein is removed; a step in which a central conductive film is formed by using a first electroplating and by using the metal seed film as the foundation therefor, said film filling in the area having the inverse coil element pattern stamped therein; and a step in which the resin mold is dissolved and the central conductive film is retrieved.

Inventors:
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
Application Number:
PCT/JP2012/006959
Publication Date:
May 08, 2014
Filing Date:
October 30, 2012
Export Citation:
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Assignee:
LEAP CO LTD (JP)
SANO TAKASHI (JP)
TERADA TOKINORI (JP)
International Classes:
H01F41/04; H01F17/00
Foreign References:
JP2004063965A2004-02-26
JP2005243807A2005-09-08
JP2008108882A2008-05-08
JP2008251640A2008-10-16
JP2008166391A2008-07-17
JP2005191408A2005-07-14
JP2006332147A2006-12-07
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
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