Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2015/198956
Kind Code:
A1
Abstract:
Provided is a technique with which it is possible to reduce the size and height of a coil module and improve the heat dissipation performance of the coil module at a low cost. A substrate-side wiring electrode pattern (16) constituting part of a coil electrode (12) is provided to a wiring substrate (20), making it possible to reduce the size and height of a resin insulating layer (31) in which a coil core (11) is embedded. Therefore, it is possible to reduce the size and height of a coil module (1) to a greater extent than in a conventional coil module in which a coil component is mounted on a wiring substrate. In addition, because a substrate-side wiring electrode pattern (16) constituting part of the coil electrode (12) is provided to the wiring substrate (20), heat generated in a coil (10) can be efficiently released from the substrate-side wiring electrode pattern (16) to the wiring substrate (20). It is therefore possible to improve the heat dissipation performance of the coil module (1) at a low cost.
Inventors:
BANBA SHINICHIRO (JP)
OTSUBO YOSHIHITO (JP)
SAKAI NORIO (JP)
NISHIDE MITSUYOSHI (JP)
OTSUBO YOSHIHITO (JP)
SAKAI NORIO (JP)
NISHIDE MITSUYOSHI (JP)
Application Number:
PCT/JP2015/067565
Publication Date:
December 30, 2015
Filing Date:
June 18, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F17/06
Domestic Patent References:
| WO2013031842A1 | 2013-03-07 |
Foreign References:
| JP2006165212A | 2006-06-22 | |||
| JP2012129364A | 2012-07-05 | |||
| JP2003243570A | 2003-08-29 | |||
| JP2010516056A | 2010-05-13 | |||
| JP2009283771A | 2009-12-03 | |||
| JPH03187208A | 1991-08-15 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
Yuji Yanase (JP)
Yuji Yanase (JP)
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