Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2017/159436
Kind Code:
A1
Abstract:
An RFID tag (101) is provided with: a circuit board (1) having a first surface (S1) and a second surface (S2) facing the first surface, a conductor pattern being formed on the circuit board (1); an electronic component mounted on the first surface (S1) of the circuit board (1), the electronic component constituting a module circuit with the conductor pattern; a resin layer (2) for sealing the electronic component; and a magnetic body member (3) overlapping on the first surface (S1) of the circuit board (1). A laminate (123) is constituted from the circuit board (1), the resin layer (2), and the magnetic body member (3), and a conductor coil (4) connected to the module circuit is wound in a direction bundling the laminate (123) around the laminate (123).
Inventors:
BANBA SHINICHIRO (JP)
Application Number:
PCT/JP2017/008869
Publication Date:
September 21, 2017
Filing Date:
March 07, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01Q7/06; G06K19/077; H04B5/02
Domestic Patent References:
| WO2016031408A1 | 2016-03-03 |
Foreign References:
| JP2002157565A | 2002-05-31 | |||
| JP2016506102A | 2016-02-25 | |||
| US20060086804A1 | 2006-04-27 | |||
| US20080309446A1 | 2008-12-18 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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