Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2018/003398
Kind Code:
A1
Abstract:
Provided is an RFID tag (101), which is a coil module, comprising: a circuit substrate (1) in which a conductor pattern is formed; an electronic component (13) which is mounted on the circuit substrate (1) and which constitutes a module circuit with the conductor pattern; a resin layer (2) which seals the electronic component (13) on the circuit substrate (1) and, together with the circuit substrate (1), forms a laminate; and a conductor coil (4) which winds around the periphery of the laminate (123) and is connected to the module circuit. Due to such a configuration, obtained is a coil module for which the magnetic flux passing through the coil opening is not easily shielded, and the effective coil opening is relatively large considering the overall size.
Inventors:
BANBA SHINICHIRO (JP)
ESHIMA KAZUKI (JP)
ESHIMA KAZUKI (JP)
Application Number:
PCT/JP2017/020537
Publication Date:
January 04, 2018
Filing Date:
June 02, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/077; H01F17/02; H01F27/00; H01F37/00; H01Q7/00
Domestic Patent References:
| WO2009145218A1 | 2009-12-03 |
Foreign References:
| JP2001510914A | 2001-08-07 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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