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Patent Searching and Data


Title:
COIL MODULE
Document Type and Number:
WIPO Patent Application WO/2018/012378
Kind Code:
A1
Abstract:
A coil module (100) is provided with: a substrate (110) that has a coil antenna (111); and a resin member (120) that covers at least one main surface of the substrate, wherein the resin member (120) is provided with a booster coil (121) that is not directly connected to the coil antenna (111) but linked therewith via a magnetic field. The diameter of the booster coil (121) may be larger than the coil diameter of the coil antenna (111), the substrate (110) is a rigid substrate, and the resin member (120) may be a member that is more flexible than the substrate (110).

Inventors:
YONEMORI, Keito (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2017/024702
Publication Date:
January 18, 2018
Filing Date:
July 05, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01F38/14; H01F17/00; H01F27/29; H01F37/00; H01L23/12; H01L25/00
Domestic Patent References:
WO2012032974A12012-03-15
Foreign References:
JP2002083894A2002-03-22
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (6F Tanaka Ito Pia Shin-Osaka Bldg., 3-10, Nishi Nakajima 5-chome, Yodogawa-ku, Osaka-cit, Osaka 11, 〒5320011, JP)
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