COIL PART AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2005/010899

A1

It is possible to realize a common mode chalk coil capable of easily realizing impedance value adjustment by changing the thickness of an impedance value adjusting insulation layer. On the entire main surface of a first magnetic substrate (1), an impedance value adjusting insulation layer (2) is formed. Furthermore, on this layer, a coil pattern and an insulation layer are alternately formed. One or both of insulation layer portion of the center area of each insulation layer surrounded by the coil pattern excluding the impedance value adjusting insulation layer (2) and the coil pattern outer circumference area are removed. Resin containing magnetic powder is provided in the insulation layer (10) of the uppermost layer and the portion where the insulation layer has been removed. A second magnetic substrate (13) is attached via an adhesion layer (12).

JP6769791	Coil board, RFID tag and RFID system
JP3493846	LAMINATED TRANSFORMER

YOSHIDA MAKOTO (JP)
OKUZAWA NOBUYUKI (JP)
ITO TOMOKAZU (JP)
KUDO TAKASHI (JP)
OTOMO MAKOTO (JP)
SATO AKIRA (JP)

PCT/JP2004/010731

February 03, 2005

July 28, 2004

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TDK CORP (JP)
YOSHIDA MAKOTO (JP)
OKUZAWA NOBUYUKI (JP)
ITO TOMOKAZU (JP)
KUDO TAKASHI (JP)
OTOMO MAKOTO (JP)
SATO AKIRA (JP)

H01F17/00; (IPC1-7): H01F17/00; H01F41/04

JP2003133135A	2003-05-09
JPH0722241A	1995-01-24
JP2001217126A	2001-08-10
JPH10135040A	1998-05-22
JPH11284471A	1999-10-15
JP2000322709A	2000-11-24

Morioka, Masaki (4th Floor 16-5, Shimizu 1-Chome, Suginami-k, Tokyo 33, JP)

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