Title:
COIL PATTERN AND FORMATION METHOD THEREFOR, AND CHIP ELEMENT HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2017/160032
Kind Code:
A1
Abstract:
The present invention presents a coil pattern and a formation method therefor, and a chip element having the same, and the coil pattern formed on at least one surface of a substrate comprises: a first plating film formed on the substrate; and a second plating film formed so as to cover the first plating film.
Inventors:
PARK IN KIL (KR)
CHO SEUNG HUN (KR)
KIM GYEONG TAE (KR)
JUNG JUN HO (KR)
PARK SANG JUN (KR)
CHO SEUNG HUN (KR)
KIM GYEONG TAE (KR)
JUNG JUN HO (KR)
PARK SANG JUN (KR)
Application Number:
PCT/KR2017/002661
Publication Date:
September 21, 2017
Filing Date:
March 13, 2017
Export Citation:
Assignee:
MODA-INNOCHIPS CO LTD (KR)
International Classes:
H01F41/04; H01F17/00; H01F27/28; H01F27/32
Foreign References:
| KR20160029293A | 2016-03-15 | |||
| KR101598295B1 | 2016-02-26 | |||
| JP2015111694A | 2015-06-18 | |||
| KR20140072796A | 2014-06-13 | |||
| KR101539879B1 | 2015-07-27 |
Attorney, Agent or Firm:
NAM, Seung-Hee (KR)
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