Title:
COIL PATTERN, METHOD FOR FORMING SAME, AND CHIP DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2017/171265
Kind Code:
A1
Abstract:
Disclosed is a coil pattern formation method, which is a method for forming a coil pattern on at least one surface of a substrate and comprises the steps of: forming a seed layer on at least one surface of a substrate; and forming at least two plating layers so as to cover the seed layer, wherein the at least two plating layers are formed by anisotropic plating.
Inventors:
PARK IN KIL (KR)
CHO SEUNG HUN (KR)
KIM GYEONG TAE (KR)
JUNG JUN HO (KR)
PARK SANG JUN (KR)
CHO SEUNG HUN (KR)
KIM GYEONG TAE (KR)
JUNG JUN HO (KR)
PARK SANG JUN (KR)
Application Number:
PCT/KR2017/002666
Publication Date:
October 05, 2017
Filing Date:
March 13, 2017
Export Citation:
Assignee:
MODA-INNOCHIPS CO LTD (KR)
International Classes:
H01F41/04; H01F17/00; H01F27/28; H05K1/16; H05K3/18
Foreign References:
| KR101565673B1 | 2015-11-03 | |||
| KR101598295B1 | 2016-02-26 | |||
| KR101558092B1 | 2015-10-06 | |||
| KR20150108518A | 2015-09-30 | |||
| KR101539879B1 | 2015-07-27 |
Attorney, Agent or Firm:
NAM, Seung-Hee (KR)
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