Title:
COLD TRANSFER DEVICE AND SEMICONDUCTOR REFRIGERATION BOX HAVING COLD TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/192298
Kind Code:
A1
Abstract:
Provided are a cold transfer device and a semiconductor refrigeration box having the cold transfer device. The cold transfer device (32) comprises one or more heat pipes (322) and an upper fin set (323). The heat pipe (322) has an upper section and a lower section. The upper section is configured to be in a direct or indirect thermal connection with a cold source so as to absorb and transfer cold of the cold source to the lower section of the heat pipe (322). The upper fin set (323) is in a direct or indirect thermal connection with the upper section of the heat pipe (322).
Inventors:
PEI YUZHE (CN)
WANG DINGYUAN (CN)
GAO XICHENG (CN)
LIU JIE (CN)
WANG DINGYUAN (CN)
GAO XICHENG (CN)
LIU JIE (CN)
Application Number:
PCT/CN2015/093661
Publication Date:
December 08, 2016
Filing Date:
November 03, 2015
Export Citation:
Assignee:
QINGDAO HAIER SMART TECH R & D CO LTD (CN)
International Classes:
F25D19/00
Foreign References:
| CN104329871A | 2015-02-04 | |||
| CN2311734Y | 1999-03-24 | |||
| US20060081770A1 | 2006-04-20 |
Attorney, Agent or Firm:
WISEAST INTELLECTUAL PROPERTY LAW FIRM (CN)
北京智汇东方知识产权代理事务所（普通合伙） (CN)
北京智汇东方知识产权代理事务所（普通合伙） (CN)
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