Title:
COLLECTION LENS HEIGHT ADJUSTING METHOD, CHIP TRANSFER METHOD, COLLECTION LENS HEIGHT ADJUSTING DEVICE, AND CHIP TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117753
Kind Code:
A1
Abstract:
Provided are an optical lens height adjusting method, a chip transfer method, a collection lens height adjusting device, and a chip transfer device with which it is possible, when transferring a chip component onto a transfer destination substrate by a laser lift-off, to obtain good transfer quality by optimizing a laser light intensity distribution at a processing surface that is the interface between the chip component and the transfer substrate. Specifically, a collection lens height adjusting method, a chip transfer method, a collection lens height adjusting device, and a chip transfer device are provided, by which the height of a collection lens is adjusted by providing, under the transfer substrate, a beam profiler having an upward light-receiving surface for measuring a laser light intensity distribution, and measuring the laser light intensity distribution through the transfer substrate at a position where the chip component is not disposed.
Inventors:
MIZUTANI YOSHIHITO (JP)
ARAI YOSHIYUKI (JP)
ARAI YOSHIYUKI (JP)
Application Number:
PCT/JP2020/045781
Publication Date:
June 17, 2021
Filing Date:
December 09, 2020
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L33/00; B23K26/57; H01L21/677; H01L21/683; H01S3/00
Foreign References:
| JP2006041500A | 2006-02-09 | |||
| JP2010251359A | 2010-11-04 | |||
| JP2014190870A | 2014-10-06 | |||
| JP2018065159A | 2018-04-26 | |||
| JP2011000600A | 2011-01-06 |
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