Title:
COLLIMATOR BONDING STRUCTURE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2012/021182
Kind Code:
A4
Abstract:
An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
Inventors:
COSTELLO KENNETH A (US)
RODERICK KEVIN J (US)
YIN EDWARD (US)
FOWLER DOUGLAS (US)
RODERICK KEVIN J (US)
YIN EDWARD (US)
FOWLER DOUGLAS (US)
Application Number:
PCT/US2011/033496
Publication Date:
May 03, 2012
Filing Date:
April 21, 2011
Export Citation:
Assignee:
INTEVAC INC (US)
COSTELLO KENNETH A (US)
RODERICK KEVIN J (US)
YIN EDWARD (US)
FOWLER DOUGLAS (US)
COSTELLO KENNETH A (US)
RODERICK KEVIN J (US)
YIN EDWARD (US)
FOWLER DOUGLAS (US)
International Classes:
H04N5/335; B23K1/00; B29C65/48; B29C65/52
Attorney, Agent or Firm:
BACH, Joseph (401 9th Street N.W., Suite 90, Washington DC, US)
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