BACKGROUND

Field

[0001] Embodiments of the present disclosure generally relate to a color conversion layer for display devices and methods of forming display devices.

Description of the Related Art

[0002] A light emitting diode (LED) panel uses an array of LEDs, with individual LEDs providing the individually controllable pixel elements. Such an LED panel can be used for a computer, touch panel device, personal digital assistant (PDA), cell phone, television monitor, ARA/R display, and the like. An LED panel that uses micron-scale LEDs based on lll-V semiconductor technology (also called micro-LEDs) would have a variety of advantages as compared to OLEDs, e.g., higher energy efficiency, brightness and lifetime, as well as fewer material layers in the display stack, which can simplify manufacturing. However, there are challenges to fabrication of micro-LED panels. Micro-LEDs having different color emission (e.g., red, green and blue pixels) need to be fabricated on different substrates through separate processes.

[0003] Bottom-up integration of color conversion layer based on color emissive materials, such as quantum dots for advanced micro-LED (e.g., light emitting diode) displays present challenges. First, subpixel isolation to ensure minimal to substantially no color emission crosstalk is difficult to achieve. As display pixels per inch (PPI) becomes higher, such as approaching single digital micron length scale regime, minimizing crosstalk becomes more of a challenge. Second, high yield of selective deposition of color emission materials is difficult to realize. Third, fabrication of subpixel isolation structures directly to backplanes include multiple detailed operations that can lead to low yield.

[0004] Accordingly, there is a need for processes for efficient fabrication of high PPI devices with minimized color crosstalk. SUMMARY

[0005] In some embodiments, a color conversion array for a multi-color display is provided. The color conversion array includes a plurality of features, each feature having a base and a distal end and a plurality of wells. Each well is defined within one or more of the plurality of features. A first color conversion layer is disposed within first wells of the plurality of wells to convert a first illumination to light of a first color. A second color conversion layer disposed within second wells of the plurality of wells to convert a second illumination to light of a second color. A first major surface or a second major surface of the array is configured to be coupled to a backplane.

[0006] In some embodiments, a multi-color display is provided. The multi-color display includes a backplane having backplane circuitry and an array of LED dies electrically integrated with the backplane circuitry. A color conversion array is coupled to the array of LED dies. The color conversion array includes a plurality of features and a plurality of wells. Each well is defined within one or more features of the plurality of features. The plurality of wells includes first wells having a first color of quantum dots and second wells having a second color of quantum dots. Each feature is aligned with gaps between adjacent dies of the array of LED dies. A light refractive material is disposed over the color conversion array.

[0007] In some embodiments, a multi-color display is provided. The multi-color display includes a backplane having backplane circuitry and an array of LED dies electrically integrated with the backplane circuitry. A color conversion array is coupled to the array of LED dies. The color conversion array includes a base portion extending from a first major surface of color conversion array to a base of a recess disposed within the color conversion array. The color conversion array further includes a plurality of features extending from the base of the recess, and a plurality of wells. Each well of the plurality of wells is defined one or more of the plurality of features and the base of the recess. The plurality of wells includes first wells having a first color of quantum dots and second wells having a second color of quantum dots. Each feature is aligned with gaps between dies of the array of LED dies. A light refractive material is disposed over sidewalls of the features.

[0008] In some embodiments, a multi-color display is provided. The multi-color display includes a backplane having backplane circuitry. An array of LED dies is electrically integrated with the backplane circuitry. A metallic grid coupled to the array of LED dies. The metallic grid including a plurality of features and a plurality of wells. Each well defined within one or more features of the plurality of features. The plurality of wells includes first wells having a first color of quantum dots and second wells having a second color of quantum dots. Each feature is aligned with gaps between dies of the array of LED dies.

[0009] In some embodiments, a method of forming a multi-color display device is provided. The method includes etching a substrate to form an array comprising a plurality of wells and a plurality of features. Each well is defined within one or more features of the plurality of features. The method includes coating the array with a refractive material and disposing a first color conversion layer within first wells of the plurality of wells. The method includes disposing a second color conversion layer within second wells of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane. The backplane includes backplane circuitry.

[0010] In some embodiments, a method of forming a multi-color display device is provided. The method includes depositing a plurality of metal features over a substrate to form a metallic grid. The multi-color display includes a plurality of wells /each well is defined within or between one or more features of the plurality of features. The method includes disposing a first color conversion layer within first wells of the plurality of wells. The method includes disposing a second color conversion layer within second wells of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane having backplane circuitry.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] So that the manner in which the above-recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of scope, as the disclosure may admit to other equally effective embodiments. [0012] FIG. 1 is a schematic top view of a micro-LED array integrated with a backplane, according to some embodiments.

[0013] FIG. 2 is a schematic cross sectional side view of a substrate suitable for processing into a color conversion array, according to some embodiments.

[0014] FIG. 3A is a schematic cross sectional side view of an etched substrate 300, according to some embodiments.

[0015] FIG. 3B is a schematic cross sectional side view of a coated etched substrate 300, according to some embodiments.

[0016] FIG. 4 is a schematic cross sectional side view of a color conversion array at a stage of fabrication, according to some embodiments.

[0017] FIG. 5 is a schematic cross sectional side view of a color conversion array at a stage of fabrication, according to some embodiments.

[0018] FIG. 6 is a schematic cross sectional side view of a color conversion array at a stage of fabrication, according to some embodiments.

[0019] FIG. 7 is a schematic cross sectional side view of a color conversion array at a stage of fabrication, according to some embodiments.

[0020] FIG. 8 is a schematic cross sectional side view of a color conversion array at a stage of fabrication, according to some embodiments.

[0021] FIG. 9 is a schematic cross sectional side view of a color conversion array prior to integrating with a backplane, according to some embodiments.

[0022] FIG. 10 is schematic cross sectional side view of a multi-color display, according to some embodiments.

[0023] FIG. 11 is a schematic cross sectional side view of a multi-color display, according to some embodiments.

[0024] FIG. 12 is a schematic cross sectional side view of an etched substrate 300, according to some embodiments. [0025] FIG. 13 is a schematic cross sectional top view of an etched substrate 300, according to some embodiments.

[0026] FIG. 14 is a schematic cross sectional side view of an etched substrate 300, according to some embodiments.

[0027] FIG. 15 is a schematic cross sectional side view of a substrate having a grid structure, according to some embodiments.

[0028] FIG. 16 is a schematic top view of a backplane, according to some embodiments.

[0029] FIG. 17 is a schematic top view of a color conversion array, according to some embodiments.

[0030] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

[0031] A method for fabricating display devices that addresses conventional challenges and a color conversion layer that is suitable for integration with a backplane is provided herein. In particular, it has been discovered that fabricating a closed or open well array made of structures that enable selective setting of quantum dot materials and subsequent integration with the backplane efficiently produces a display stack that is substantially free of color emission crosstalk. Several approaches to selective setting of quantum dot materials within the wells are contemplated, including without imitating, coating a layer of photo-curable fluid containing a color conversion agent (CCA) for a first color, turning on a light sources, such as a laser beam over selected wells to trigger polymerization and immobilize the CCA in the vicinity of the selected subpixels. The uncured fluid over the non-selected subpixels can be removed, and the same process can be repeated with CCAs for different colors until all subpixels on the substrate are covered with CCAs of predetermined colors.

[0032] FIG. 1 is a schematic top view of a micro-LED display 10 that includes an array 12 of individual micro-LEDs 14 integrated with a backplane 16. The micro-LEDs dies 14 are integrated with backplane circuitry 18 so that each micro-LED 14 can be individually addressed. For example, the backplane circuitry 18 can include a thin film transistor (TFT) active matrix array with a thin-film transistor and a storage capacitor (not illustrated) for each micro-LED, column address and row address lines 18a, column and row drivers 18b, etc., to drive the micro-LEDs 14. Alternatively, the microLEDs 14 can be driven by a passive matrix in the backplane circuitry 18. The backplane 16 can be fabricated using conventional CMOS processes.

[0033] FIG. 2 to FIG. 9 represent schematic cross-sectional side views of the color conversion array at various stages of fabrication. FIG. 2 is a schematic cross sectional side view of a substrate 202 suitable for processing into a color conversion array, according to some embodiments. The substrate 202 can be a transparent substrate, such as glass or a polymer. The substrate 202 can be any solid-state material, such as a PET, silicon dioxide (SiO2), fused silica, amorphous silica, ceramics or combinations thereof. The substrate 202 has a thickness 201 of about 25 pm to about 100 pm, such as about 50 pm to about 75 pm.

[0034] FIG. 3A is a schematic cross sectional side view of the substrate 202 etched, according to certain embodiments of the present disclosure. The substrate 202 can be etched to form an etched substrate 300. The etched substrate 300 has a first major surface 308A and a second major surface 308B. The etched substrate 300 includes a plurality of features 306 and a plurality of wells 302 defined within one or more features 306. In some embodiments, the plurality of features 306 are in the form of a grid structure, such as an interconnected grid having square shaped wells.

[0035] The etched substrate 300 can have a border area 304 that surrounds the plurality of wells 302 and the plurality of features 306. In some embodiments, a laser induced direct etching process is used to form the plurality of wells 302 and plurality of features 306. Each of the plurality of wells can have a width 301 that can be smaller at a base of the well between proximate ends 306A of adjacent feature portions relative to a width 303 disposed between distal ends 306B of adjacent feature portions. In an embodiment, the widths 301 , 303 of each well is between about 1 pm to about 100 pm. One or more of the plurality of features 306 can have a height 305. In an embodiment, the height 305 is between about 1 pm to being substantially the same height as the border area 304. [0036] FIG. 3B depicts the etched substrate 300 after being coated with a material 312, such as a refractive material, a light shielding material, or other opaque material. Without being bound by theory, it is believed that coating the etched substrate 300 with a refractive material isolates light intrusion through the plurality of features 306 and isolates each of a plurality of wells 310 defined within one or more coated features 306. The material 312 can be a metal-containing coating, such as metallic aluminum, metallic silver, dielectric carbon, or combinations thereof. The material 312 is introduced conformally, at a thickness of about 50 nm or greater, such as about 500 nm to 800 nm. The etched substrate 300 can be coated with the material 312 by a deposition process to achieve a conformal result, including without limitation, a chemical vapor deposition (CVD) process, atomic layer deposition (ALD) process, physical vapor deposition (PVD) process, and plasma enhanced vapor deposition processes. The material 312 prevents color cross contamination when RGB quantum dots are lit during display operation.

[0037] The coated etched substrate 300 can be coupled to a second substrate 402, as shown in FIG. 4. The second substrate 402 is coupled to the coated etched substrate 300 via an adhesive polymer layer 404. In one embodiment, the adhesive polymer layer 404 is formed from pressure sensitive polymers, UV curable polymers, thermal curable polymers, and the like. In some aspect, the adhesive polymer layer 404 is transparent and enables light penetration. In another aspect, the adhesive polymer layer 404 has a thickness from about 10 nm to about 50 pm.

[0038] As depicted in FIG. 5, a base matrix 502 is applied within each of the plurality of wells and over the plurality of features. In an embodiment, the base matrix 502 is formed from materials including without limitation, acrylates, polyurethane, epoxies, and other optically transparent polymers. In an embodiment, the base matrix 502 is conformally coated over the base matrix 502. In one embodiment, which can be combined with other embodiments herein, the base matrix 502 can be spin coated to provide leak proof wells.

[0039] FIG. 6 depicts a first color conversion layer 602 deposited within a first well 604 of the plurality of wells. The first color conversion layer 602 includes color conversion agents that can convert received light having a first wavelength into a wavelength for a color light, e.g., red, green, or blue light for red, green, or blue subpixels. The first color conversion layer 602 can be a quantum dot of a first color and can be deposited using any suitable process, such as selective or non-selective inkjet, selective or non-selective spin-coating, selective or non-selective spray coating. The first color conversion layer 602 can be cured using any suitable process such as selective UV cure, such as by use of a laser, such as by use of a flood light source, such as from a bottom of each well, or such as or from the top of each well. In one aspect, the curing process for the first color conversion layer 602 is performed in an inert environment, such as in a process chamber filled with an inert gas, such as argon, nitrogen, or combinations thereof. In some embodiments, the first color conversion layer 602, such as a red color is filled into every well, and then selectively cured. Selectively curing, in some embodiments, includes scanning a laser along a raster path and selectively turning on the laser spot at well array locations to be cured or fixed. The unfixed or uncured color conversion layer can be washed or removed using solvent such as isopropyl alcohol.

[0040] This process can be repeated with other additional color conversion layers of other colors. Once done with selectively depositing quantum dots (QD), integration to the backplane is then conducted. In one embodiment, the thickness of the cured QD ranges from between about 1 pm to about 50 pm. In some embodiments, external laser sources are used and aligned with a base of the wells.

[0041] Fig. 7 depicts a second color conversion layer 702 deposited within a second well 704 of the plurality of wells. The second color conversion layer 702 can be deposited and cured using any of the processes described relative to the first color conversion layer 602. Additional color conversion layers of additional colors can further be deposited and cured as described relative to the first and second color conversion layers.

[0042] Once all of the colors are deposited and cured, additional blocking layers 802, such as protective layers, passivation layers, and other layers can be deposited over the cured color conversion layers, as shown in FIG. 8. In one embodiment, which can be combined with other embodiments herein, the blocking layers 802 are formed from materials such as SiO2, Si3N4, optically transparent organic and inorganic thin films, and the like. Although not depicted, other processes are also contemplated such as planarization or leveling of layers or fillers. [0043] FIG. 9 depicts a color conversion array for a multi-color display after the adhesive polymer layer 404 and the second substrate 402 are removed, such as by solvent, such as isopropyl alcohol. The color conversion array can then be coupled to a backplane 1002 along the first major surface 308A, as shown in FIG. 10. The color conversion array may be coupled to the backplane 1002 via an adhesive layer (not shown). In an embodiment, the border area 304 can be trimmed to substantially the size of the well array before being integrated with the backplane 1002. In one embodiment, which can be combined with other embodiments herein, the backplane 1002 is formed from material including without limitation, glass, flexible polymer films, and the like. The adhesive layer can be spin coated or drop casted onto the first major surface 308A. The color conversion array can be aligned to the backplane 1002 and coupled by bonding using any known bonding process, including without limitation, thermal bonding UV bonding, and the like. The temperature for bonding can be less than about 100 °C to mitigate damage to the circuitry. The backplane 1002 may include a plurality of micro-LED dies 1004 separated by a plurality of gaps 1006. Proximate ends 306A of each of the features 306 can be aligned with a corresponding gap 1006 between each of the plurality of micro-LED dies 1004 of the backplane 1002. In some embodiments, the base portions of the features 306 can at least partially penetrate the gaps 1006 to suppress or eliminate color crosstalk and/or photon leakage from the micro-LED dies 1004 to neighboring wells.

[0044] Alternatively, the second major surface 308B can be coupled to the backplane 1002, as shown in FIG. 11. The backplane 1002 can be coupled via an adhesive layer (not shown) such that the distal ends 306B of the features 306 are aligned with the gaps 106 between the micro-LED dies 1004. In some embodiments, the distal ends 306B may at least partially penetrate the gaps 106 in order to enhance color crosstalk isolation. In some embodiments, the distal ends 306B extend to the second major surface 308B of the color conversion array.

[0045] Alternatively, as shown in FIG. 12, the color conversion array may include a first recess 1200 that includes the features 306 and the wells 302, and a second recess 1201 disposed radially outward from the first recess 1200 having a planar surface that is between the first major surface 308A and the second major surface 308B of the color conversion array. The second recess 1201 can have a radial distance 1202, which can be about 1 millimeter or less. In some embodiments, the features 306 disposed between two wells 302 of the plurality of wells 302 is tapered from the base at the proximate end 306A to the distal end 30BA of each feature 306 with a taper angle 9 between about -0 degrees to about 10 degrees. A distance 1204 between the first and second major surface can be about 100 pm or less, such as about 50 pm or less. A well width 1206 at a base of each well 302 can be about 1 pm to about 50 pm, such as about 20 pm to about 30 pm. Each of the plurality of features 306 can have a height 1208 between about 5 pm to about 30 pm, such as about 15 pm to about 20 pm.

[0046] FIG. 13 depicts a top view of an example color conversion array 1300, such as any color conversion array described herein, according to certain embodiments. In some embodiments, the color conversion array 1300 may sized in which a total width 1302 of the array portion is between about 5 millimeters and about 300 mm, and a total height 1304 of the array portion is be about 5 millimeters and about 300 mm. In some embodiments, a first side of a first well to a first side of an adjacent well can have a distance 1306. In some embodiments, the distance 1306 can be about 3 to about 50 pm. In some embodiments, a feature width 1308 between wells can be about 1 pm to about 20 pm, such as about 10 pm.

[0047] FIG. 14 depicts a cross-sectional side view of a color conversion array 1400, according to certain embodiments. The color conversion array 1400 may be etched to a depth that is between the first major surface 1406A and the second major surface 1406B of the color conversion array. The color conversion array 1400 includes a base portion 1401 and a plurality of wells 1410 defined by a plurality of features 1416. Each of the plurality of features 1416 may have a height 1408 extending from the base portion 1401 to the second major surface 1406B. The color conversion array 1400 also includes a thickness 1402 between the first major surface 1406A and the second major surface 1406B. In some embodiments, the thickness 1402 is about 100 pm or less, such as about 50 pm or less. Each of the plurality of features 1416 may be tapered at an angle Q between about 0 degrees to about 10 degrees, such as about 6 degrees to about 8 degrees. Each of the plurality of wells 1410 may include a well width 1404 at a base 1414 of each well 1410. In some embodiments, the well width 1404 is about 1 pm to about 50 pm, such as about 20 pm to about 30 pm. A refractive material can be coated along sidewalls of the features 1416 to visibly isolate each of the wells 1410 from one another. The base 1414 of each well 1410 can remain uncoated in order to enable light, such as a laser light to cure color conversion layers of each well 1410. In particular, the features 1416 can be composed of a transparent material such as glass. In one embodiment, the color conversion layers of each well 1410 is cured by a light source with a wavelength between about 365 nm to about 405 nm. In another embodiment, the wavelength of the light source depends on the type of photo-initiator used in the composition of the color conversion layers.

[0048] FIG. 15 depicts a cross-sectional side view of a color conversion array including metallic features 1512, such as aluminum or silver features. Each metallic feature 1512 can be about 5 pm to about 50 pm, such as about 15 pm to about 20 pm in height 1516. The metallic features 1512 can be spaced apart by a distance 1514 between about 2 pm and about 80 pm, such as about 25 pm and about 35 pm. The metallic features 1512 can be about 1 pm to about 20 pm in width 1510, such as about 3 pm to about 5 pm. Each of the metallic features 1512 can have a base portion at the interface with a substrate 1506, such as a glass substrate having a thickness 1522 of about 1 pm to 100 pm . The base portions of each of the metallic features 1512 can be spaced apart by a distance 1508 of about 0.5 pm to about 60 pm, such as about 20 pm to about 30 pm. The substrate 1506 can be coupled to a second substrate 1502 via an interposer 1504, such as double-sided adhesives, pressure-sensitive adhesives, thermal release film, light sensitive release film, and the like. In one embodiment, the second substrate 1502 can be a carrier substrate, such as a glass substrate with a thickness 1518 of about 200 pm to about 1 millimeter.

[0049] FIG. 16 is a schematic top view of a backplane 1600, according to some embodiments. The backplane 1600 can include an active region 1602 and one or more fiducials 1604. The backplane 1600 can also include backplane circuitry (not shown). FIG. 17 is a schematic top view of a color conversion array 1700, according to some embodiments. The color conversion array 1700 can include a laser-diced outline 1702 and one or more fiducials 1704. The one or more fiducials 1704 correspond to the one or more fiducials 1604 of the backplane 1600 which enable alignment of the laser-diced outline 1702 portion of the color conversion array 1700 relative to the active region 1602 of the backplane 1600.

Additional Aspects [0050] The present disclosure can include the following non-limiting aspects and/or embodiments:

[0051] Clause A1 . A color conversion array for a multi-color display, comprising: a plurality of features, each feature having a base and a distal end; a plurality of wells, each well defined within one or more of the plurality of features; a first color conversion layer disposed within first wells of the plurality of wells to convert a first illumination to light of a first color; and a second color conversion layer disposed within second wells of the plurality of wells to convert a second illumination to light of a second color, wherein a first major surface or a second major surface of the array is configured to be coupled to a backplane.

[0052] Clause A2. The color conversion array of Clause A1 , wherein each feature disposed between two wells of the plurality of wells is tapered from the base to the distal end of each feature, wherein the taper angle is about 0 degrees to about 10 degrees.

[0053] Clause A3. The color conversion array of Clause A1 or Clause A2, wherein the color conversion array further comprises fiducials configured to align with fiducials disposed on the backplane.

[0054] Clause A4. The color conversion array of any of Clauses A1 to A3, further comprising: a base portion extending from the first major surface of color conversion array to a base of a first recess disposed within the color conversion array, the plurality of features extending from the base of the first recess, each well of the plurality of wells defined by the plurality of features and the base of the first recess.

[0055] Clause A5. The color conversion array of Clause A4, further comprising a second recess disposed radially outward from the first recess, wherein a base of the second recess is disposed between the second major surface and the base of the first recess.

[0056] Clause A6. The color conversion array of any of Clauses A1 to A5, wherein the plurality of features are interconnected.

[0057] Clause A7. The color conversion array of any of Clauses A1 to A6, further comprising a refractive material over the plurality of features. [0058] Clause A8. The color conversion array of Clause A7, further comprising a base matrix disposed within each of the plurality of wells.

[0059] Clause A9. The color conversion array of any of Clauses A1 to A8, further comprising a polymer coupled to the first major surface of the color conversion array.

[0060] Clause A10. The color conversion array of any of Clauses A1 to A10, further comprising one or more layers over the first and second color conversion layers.

[0061] Clause B1. A multi-color display, comprising: a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; a color conversion array coupled to the array of LED dies, the color conversion array comprising a plurality of features and a plurality of wells, each well defined within one or more features of the plurality of features, wherein the plurality of wells comprise first wells having a first color of quantum dots and second wells having a second color of quantum dots, wherein each feature is aligned with gaps between the array of LED dies; and a light refractive material disposed over the color conversion array.

[0062] Clause B2. The multi-color display of Clause B1 , wherein a distal end of each feature is aligned with gaps between dies of the array of LED dies.

[0063] Clause B3. The multi-color display of Clause B1 or B2, wherein a proximate end of each feature is aligned with gaps between dies of the array of LED dies.

[0064] Clause B4. The multi-color display of any of Clauses B1 to B3, wherein each feature disposed between two wells of the plurality of wells is tapered from the base to the distal end of each feature, wherein the taper angle is about 0 degrees to about 10 degrees.

[0065] Clause B5. The multi-color display of any of Clauses B1 to B4, wherein the color conversion array further comprises fiducials aligned with fiducials disposed on the backplane.

[0066] Clause C1. A multi-color display, comprising: a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; a color conversion array coupled to the array of LED dies, the color conversion array comprising: a base portion extending from a first major surface of color conversion array to a base of a recess disposed within the color conversion array, a plurality of features extending from the base of the recess, and a plurality of wells, each well of the plurality of wells defined by the plurality of features and the base of the recess, wherein the plurality of wells comprise first wells having a first color of quantum dots and second wells having a second color of quantum dots, wherein each feature is aligned with gaps between the array of LED dies; and a light refractive material disposed over sidewalls of the features.

[0067] Clause C2. The multi-color display of Clause C1 , wherein the base of the recess is transparent to light.

[0068] Clause C3. The multi-color display of Clause C1 or Clause C2, wherein each feature is mesa shaped, wherein a distal end of each feature is substantially coplanar with a major surface of the color conversion array.

[0069] Clause C4. The multi-color display of any of Clauses C1 to C3, wherein the light refractive material is a metal containing material.

[0070] Clause C5. The multi-color display of any of Clauses C1 to C4, wherein a top cross-section of at least one well is rectangular.

[0071] Clause D1. A multi-color display, comprising: a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; and a metallic grid coupled to the array of LED dies, the metallic grid comprising a plurality of features and a plurality of wells, each well defined within one or more features of the plurality of features, wherein the plurality of wells comprise first wells having a first color of quantum dots and second wells having a second color of quantum dots, wherein each feature is aligned with gaps between the array of LED dies.

[0072] Clause E1. A method of forming a multi-color display device, comprising; etching a substrate to form an array comprising a plurality of wells and a plurality of features, each well is defined within one or more features of the plurality of features; coating the array with a refractive material; disposing a first color conversion layer within first wells of the plurality of wells; disposing a second color conversion layer within second wells of the plurality of wells to form a color conversion array; integrating the color conversion array with a backplane, the backplane comprising circuitry.

[0073] Clause E2. The method of Clause E1 , further comprising coupling a first major surface of the coated array to a base via a polymer.

[0074] Clause E3. The method of Clause E1 or Clause E2, further comprising dissolving the polymer with a solvent.

[0075] Clause E4. The method of any of Clauses E1 to E3, wherein the first color conversion layer comprises red, blue, or green quantum dots.

[0076] Clause E5. The method of any of Clauses E1 to E4, further comprising spin-coating a base matrix within the plurality of wells and over the plurality of features.

[0077] Clause E6. The method of any of Clauses E1 to E5, wherein integrating the color conversion array with the backplane comprises aligning fiducials of the color conversion array with fiducials of the backplane.

[0078] Clause E7. The method of any of Clauses E1 to E6, wherein integrating the color conversion array with the backplane comprises aligning distal ends of the plurality of features with gaps between individual LED dies.

[0079] Clause E8. The method of any of Clauses E1 to E7, wherein integrating the color conversion array with the backplane comprises aligning distal end of the plurality of features with gaps between individual LED dies.

[0080] Clause E9. The method of any of Clauses E1 to E8, wherein integrating the color conversion array with the backplane comprises aligning proximate ends of the plurality of features with gaps between individual LED dies.

[0081] Clause E10. The method of any of Clauses E1 to E9, wherein integrating the color conversion array with the backplane comprises at least partially penetrating a gap between adjacent LED dies with a portion of the plurality of features. [0082] Clause E11 . The method of any of Clauses E1 to E10, wherein disposing a first color conversion layer within first wells of the plurality of wells comprises curing quantum dots of a first color by emitting light through a base of the first wells.

[0083] Clause E12. The method of Clause E11 , wherein disposing a first color conversion layer within first wells of the plurality of wells comprises selectively depositing into the first wells.

[0084] Clause E13. The method of Clause E11 , wherein disposing a first color conversion layer within first wells of the plurality of wells comprises: depositing the first color conversion layer into the plurality of wells; selectively curing the first color conversion layer within the first wells of the plurality of wells; and removing the uncured first color conversion layer from at least one other well of the plurality of wells.

[0085] Clause E14. The method of Clause E13, wherein selectively curing comprises scanning laser spots along a raster path and selectively turning on the laser when aligned with a base of the first wells.

[0086] Clause E15. The method of Clause E13, wherein removing uncured first color conversion layer comprises washing the uncured first color conversion layer from at least one of the wells of the plurality of wells with a solvent, such as isopropyl alcohol.

[0087] Clause F1. A method of forming a multi-color display device, comprising; depositing a plurality of metal features over a substrate to form a metallic grid comprising a plurality of wells, each well is defined within or between one or more features of the plurality of features; disposing a first color conversion layer within first wells of the plurality of wells; disposing a second color conversion layer within second wells of the plurality of wells to form a color conversion array; integrating the color conversion array with a backplane, the backplane comprising circuitry.