Title:
COMBINATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/124630
Kind Code:
A1
Abstract:
Provided is a combination sensor, comprising: a substrate (1); a first ASIC chip (2) and a second ASIC chip (3) mounted in the substrate (1); a first lead plate (4) and a second lead plate (5) arranged on the substrate (1); a first MEMS chip (6) and a second MEMS chip (7) mounted on the surface of the substrate (1); the first MEMS chip (6) is a capacitive structure; the operating voltage of the second MEMS chip (7) is alternating current voltage; the first MEMS chip (6) is electrically connected to the first ASIC chip (2) by means of the first lead plate (4), and the second MEMS chip (7) is electrically connected to the second ASIC chip (3) by means of the second lead plate (5); the shortest distance between the first MEMS chip (6) and the second lead plate (5) is d1, wherein d1≥0.3 mm; the shortest distance between the first lead plate (4) and the second lead plate (5) is d2, wherein d2≥1.2 mm. The combination sensor has the advantages of reducing the effect of parasitic capacitance, decreasing electromagnetic induction, and reducing the background noise of the first MEMS chip (6).
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Inventors:
YANG JUNWE (CN)
WANG DEXIN (CN)
PAN XINCHAO (CN)
DUANMU LUYU (CN)
QIU WENRUI (CN)
WANG DEXIN (CN)
PAN XINCHAO (CN)
DUANMU LUYU (CN)
QIU WENRUI (CN)
Application Number:
PCT/CN2018/123796
Publication Date:
June 25, 2020
Filing Date:
December 26, 2018
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R19/04
Foreign References:
| CN209017323U | 2019-06-21 | |||
| CN208094792U | 2018-11-13 | |||
| CN205864743U | 2017-01-04 | |||
| CN205140944U | 2016-04-06 | |||
| CN206413130U | 2017-08-15 | |||
| CN206683673U | 2017-11-28 | |||
| US20180343524A1 | 2018-11-29 |
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