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Patent Searching and Data


Title:
COMBINED CUTTING AND GRINDING TOOL
Document Type and Number:
WIPO Patent Application WO/1998/055265
Kind Code:
A1
Abstract:
A combined cutting and grinding tool comprising columnar diamonds (22) arranged so as to protrude from the surface of the tool and conductive bonding member (24) for integrally bonding the columnar diamonds (22) to the surface of the tool, wherein the bonding member (24) performs electrolytic dressing while allowing a conductive fluid to flow between the same and electrodes (4) facing the same at intervals, whereby the columnar diamonds (22) can protrude. This arrangement makes it roughly work a ductile material with a large depth of cut, to precisely grind a brittle material with efficiency and stability and to offset variation in working position due to abrasion.

Inventors:
OHMORI HITOSHI (JP)
MORIYASU SEI (JP)
NAKAGAWA TAKEO (JP)
Application Number:
PCT/JP1998/002458
Publication Date:
December 10, 1998
Filing Date:
June 03, 1998
Export Citation:
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Assignee:
RIKAGAKU KENKYUSHO (JP)
OHMORI HITOSHI (JP)
MORIYASU SEI (JP)
NAKAGAWA TAKEO (JP)
International Classes:
B24B53/00; B24D3/00; B24D3/34; B24D5/06; B24D7/06; (IPC1-7): B24D5/06; B24D7/06; B24D3/00; B24D3/34
Foreign References:
JPH0655459A1994-03-01
JPS59214561A1984-12-04
JPH05318325A1993-12-03
JPH08309702A1996-11-26
JPH07136936A1995-05-30
JPS62172523U1987-11-02
JPS6150660U1986-04-05
Other References:
See also references of EP 0917931A4
Attorney, Agent or Firm:
Hotta, Minoru (3F Hara Building 2, 15-6, Shiba 4-chom, Minato-ku Tokyo, JP)
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