Title:
COMBINED MANIPULATOR FOR SILICON WAFER TRANSFER
Document Type and Number:
WIPO Patent Application WO/2019/200688
Kind Code:
A1
Abstract:
A combined manipulator for silicon wafer transfer, comprising a first manipulator, a second manipulator, and a connecting base (3). The first manipulator comprises a first sucker group (1-2). The second manipulator comprises a second sucker group (2-2). When the second sucker group (2-2) is flush with the first sucker group (1-2), silicon wafers (5) adsorbed by the first sucker group (1-2) and silicon wafers (5) adsorbed by the second sucker group (2-2) constitute a silicon wafer array (6).
Inventors:
WU JUN (CN)
WU JIAHONG (CN)
ZHANG KAISHENG (CN)
YAO WEIZHONG (CN)
SUN TIETUN (CN)
WU JIAHONG (CN)
ZHANG KAISHENG (CN)
YAO WEIZHONG (CN)
SUN TIETUN (CN)
Application Number:
PCT/CN2018/091517
Publication Date:
October 24, 2019
Filing Date:
June 15, 2018
Export Citation:
Assignee:
EGING PHOTOVOLTAIC TECH CO LTD (CN)
International Classes:
B25J15/06; H01L21/67; H01L21/677
Foreign References:
| CN105374730A | 2016-03-02 | |||
| CN106252266A | 2016-12-21 | |||
| CN107658257A | 2018-02-02 | |||
| KR20100096366A | 2010-09-02 |
Attorney, Agent or Firm:
CHANGZHOU INNOVATION PATENT AGENCY FIRM (GENERAL PARTNER) (CN)
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